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전기전자재료학회논문지
v.15
no.4
선형가열기를 이용한 Si
$SiO_{2}/Si_{3}N_{4}$ ⅡSi 이종기판쌍의 직접접합 이상현;이상돈;송오성 https://doi.org/10.4313/JKEM.2002.15.4.301 - J. Appl. Phys. v.64 no.10 Bonding of silicon wafers for silicon-on-insulator Maszara,W.P.;Goetz,G.;Caviglia,A.;McKitterick,J.B. https://doi.org/10.1063/1.342443
- Engineering Fracture Mechanics v.61 Adhesion and debonding of multilayer thin film structures R.H.Dauskardt;M.Lane;Q.Ma;N.Krishna https://doi.org/10.1016/S0013-7944(98)00052-6
- Mechanical Properties of Ceramics J.K.Lee
- Jpn. J. Appl. Phys. v.28 no.8 Silicon-on-Insulator wafer bonding-wafer thining technological evaluation Haisima,J.;Spiering,G.A.C.M.;Biermann,U.K.P.;Pals,J.A. https://doi.org/10.1143/JJAP.28.1462
- J. Electrochem. Soc. v.144 no.1 The crack opening method in silicon wafer bonding. how useful is it? Martini,T.;Steinkirchner,J.;Gosele,U. https://doi.org/10.1149/1.1837409