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Fabrication and Properties of Ni and Ni-W Electroplated Molds Using LIGA-like Process for Replication of Micro Components

LIGA-like 공정을 이용한 마이크로 부품 복제용 Ni과 Ni-W 금형 제조 및 특성

  • Hwang, W.S. (Dept. of Materials Engineering, Hankuk Aviation University) ;
  • Park, J.S. (Korea Electronics Technology Institute) ;
  • Kang, Y.C. (Korea Electronics Technology Institute) ;
  • Cho, J.W. (Korea Electronics Technology Institute) ;
  • Park, S.S. (Korea Electronics Technology Institute) ;
  • Lee, I.G. (Dept. of Materials Engineering, Hankuk Aviation University) ;
  • Kang, S.G. (Dept. of Materials Science and Engineering, Hanyang University)
  • Published : 2003.01.01

Abstract

Electroplated Ni and Ni-W micro-molds using LIGA-like process for replication of micro-components such as microfluidic parts and micro optical parts have been investigated. In general, it is hard to produce micro-parts using conventional mechanical processes. Micro-mold formed by LIGA-like process could fabricate micro-parts with high aspect ratio. In this paper, fabrication and properties of electroplated Ni molds with varying applied current types as well as those of Ni-W molds were investigated. Ni molds fabricated under pulse-reverse current showed the highest hardness value of about 160 Hv. Ni-W molds showed the hardness of about 500 Hv which was much harder than that of Ni electroplated molds. The above results suggested that high quality micro-molds could be fabricated by using Ni electroplating of pulse-reverse type for core molds and sequential Ni-W alloys coating.

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