Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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Characteristics of Electroplated Sn-2.5Cu Alloy Layers for Surface Finishing

표면마무리를 위한 Sn-2.5Cu 합금 도금막의 특성

  • Kim, Ju-Youn (Division of Materials Science and Engineering, Hanyang University) ;
  • Bae, Kyoo-Sik (Department of Electronic Materials Engineering, The University of Suwon)
  • 김주연 (한양대학교 재료공학부) ;
  • 배규식 (수원대학교 전자재료공학과)
  • Published : 2003.02.01
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Abstract

Sn-2.5Cu alloy layers were deposited on the Alloy 42 lead-frame substrates by the electroplating method, and their microstructures, adhesion strength, and electrical resistivity were measured to evaluate the applicability of Sn-Cu alloy as a surface finishing material of electronic parts. The Sn-2.5Cu layers were electroplated in the granular form, and composed of pure Sn and Cu$_{6}$Sn$_{5}$ intermetallic compound. Surfaces of the electroplated Sn-2.5Cu layers were rather rough and also the thickness variance was large. The adhesion strength of the Sn-2.5Cu electroplated layers was highly comparable to that of the electroplated Cu alloy layer and the electrical conductivity was about 10 times higher than the pure Sn. After the 20$0^{\circ}C$ 30 min. annealing of the electroplated Sn-2.5Cu layers, the surface roughness was reduced, and adhesion strength and conductivity were improved. These results showed the Sn-Cu alloys can be used as an excellent surface finishing material.ial.

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