Journal of the Korea Institute of Information and Communication Engineering (한국정보통신학회논문지)

The Korea Institute of Information and Commucation Engineering (한국정보통신학회)
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Design of Housing Structure for the Suppression of Higher­Order Modes in the Microstrip Circuit Packaging

마이크로스트립 회로 패키징의 고차모드 차폐를 위한 하우징 설계

  • 전중창 (진주산업대학교 전자공학과)
  • Published : 2003.12.01
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Abstract

Packaging structures to block the propagation of higher­order modes in the shielded microstrip lines are designed. Packaging for microwave circuits is necessary, basically, to isolate and protect circuits from outside environments both physically and electrically. The drawback of packaging is the possibility of higher­order mode propagation, similar to waveguide modes, as the operating frequency increases. One of Possible choices for the higher­order mode suppression is to insert diaphragms to the housing structure. The shielding effects of diaphragms are analyzed using an FEM code. Several parameters such as dispersion, mode conversion, and higher­order mode transmission and reflection are analyzed. The effect of higher­order mode suppression is eminent as the depth or width of a diaphragm is increased in the air region of the microstrip line. It is shown that inductive diaphragm structure can lower ${S_21}$ for the second­order mode incidence by 30㏈, comparing with the conventional capacitive diaphragm structure. Packaging structure analyzed in this paper can be applied usefully to the design of the microwave system in a package such as transmit/receive modules.

본 논문에서는, 마이크로스트립 회로의 패키징에서 고차모드 전파를 억제할 수 있는 유도성 격벽구조를 설계한다. 마이크로파 패키징은 회로를 외부의 물리적, 전기적 환경으로부터 격리$.$보호하기 위해 필요한 반면에, 동작 주파수가 증가함에 따라 하우징에 의한 고차모드가 발생하는 문제점을 내포하고 있다. 즉, 특성임피던스 및 실효유전율에 대한 영향을 줄이기 위해서는 패키징 크기가 가능한 커야 하지만, 패키징을 통과할 수 있는 고차모드의 차단 주파수를 높이기 위해서는 패키징 크기가 가능한 작아야 한다. 본 논문에서 제안된 유도성 격벽 패키지는 기존의 용량성 격벽 패키지에 비하여 고차모드 전력전달 억제계수$({S_21})$가 30㏈ 더 개선되었으며, 고차모드의 전달을 효과적으로 억제함으로써, 송수신 모듈과 같은 마이크로파 시스템 패키지화(System­in­a­Package) 설계에 유용하게 활용될 수 있다.

Keywords

References

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