Elastomers and Composites

The Rubber Society of Korea (한국고무학회)
권호 표지

Curing and Rheological Behavior of Epoxy Resin Compositions for Underfill

언더필용 에폭시 수지 조성물의 경화 및 유변학적 거동

  • Kim, Yoon-Jin (Division of Materials Science & Engineering, Korea University) ;
  • Park, Min (Polymer Hybrid Center, Korea institute of Science & Technology) ;
  • Kim, Jun-Kyung (Polymer Hybrid Center, Korea institute of Science & Technology) ;
  • Kim, Jin-Mo (Electronic Chemical Materials Division, Cheil Industries Inc.) ;
  • Yoon, Ho-Gyu (Division of Materials Science & Engineering, Korea University)
  • 김윤진 (고려대학교 재료공학과) ;
  • 박민 (한국과학기술연구원 고분자 하이브리드 센터) ;
  • 김준경 (한국과학기술연구원 고분자 하이브리드 센터) ;
  • 김진모 (제일모직(주) 정보통신소재 사업부) ;
  • 윤호규 (고려대학교 재료공학과)
  • Published : 2003.09.30
Download PDF
⟨ Previous Next ⟩

Abstract

The cure and rheological behavior of diglycidyl ether of bisphenol F/nadic methyl anhydride resin system with the kinds of imidazole were studied using a differential scanning calorimeter (DSC) and a rotational rheometer. The isothermal traces were employed to analyze cure reaction. The DGEBF/ anhydride conversion profiles showed autocatalyzed reaction characterized by maximum conversion rate at $20{\sim}40 %$ of the reaction. The rate constants ($k_1,\;k_2$) showed temperature dependance, but reaction order did not. The reaction order (m+n) was calculated to be close to 3. There are two reaction mechanisms with the kinds oi catalyst. The gel time was determined by using G'-G" crossover method, and the activation energy was obtained from this results. From measurement of rheological properties it was found that the logarithmic 1:elation time of fused silica filled DBEBF epoxy compounds linearly increased with the content of filler and decreased with temperature. The highly filled epoxy compounds showed typical pseudoplastic behavior, and the viscosity of those decreased with increasing maximum packing ratio.

Imidazole 촉매의 종류에 따른 bisphenol-F계 에폭시 (Diglycidyl ether of bisphenol-F)/nadic methyl anhydride 수지 시스템의 경화 및 유변학적 거동이 시차주사열량계 (differential scanning calorimeter)와 회전 점도계를 사용하여 연구되었다. 경화반응기구를 분석하기 위해서 몇 개의 등온경화온도에서 등온시험이 수행되었다. Bisphenol-F계 에폭시/anhydride 조성물의 경화곡선은 전환량이 $20{\sim}40 %$일 때 최대 값을 보이는 자체촉매반응을 나타내었다. 속도상수($k_1,\;k_2$)는 온도 의존성을 가지나 반응차수 (m+n)는 온도 의존성이 없었으며, 반응차수는 거의 3으로 계산되었다. 촉매의 종류에 따라 두 개의 반응기구를 가지고 있었다. G'-G" crossover 방법을 통해 겔화 시간을 측정하였으며, 이 결과로부터 활성화에너지를 구하였다. 용융 실리카를 첨가한 조성물의 유변학적 거동으로부터 온도와 충전제 함량에 따른 겔화 시간의 대수 변화가 직선적인 관계를 나타낸다는 것을 알 수 있었다. 고충전된 에폭시 수지 조성물은 전형적인 준소성 거동을 보였으며, 최대충전밀도가 클수록 점도는 낮아졌다.

Keywords

References

  1. L. Wang and C. P. Wong, 'Study of Additive-epoxy Interaction of Thermally Reworkable Undcrfills', J. Appl. Polym. Sci., 81, 1868 (2001) https://doi.org/10.1002/app.1620
  2. G. Jungang, L. Deling, S. Shigang, and L. Guodong, 'Curing Kinetics and Thermal Property Characteri-zation of a Bisphenol-F Epoxy Resin and DDO System', J. Appl. Polym. Sci., 83, 1586 (2002) https://doi.org/10.1002/app.10139
  3. R. B. Prime, 'Thermal Characterization of Polymeric Materials' ed. by E. A. Turi, chap. 5, Academic Press, New York, 1983
  4. K. S. Moon, S. D. Hwang, H. G. Yoon, J. H. Ryu, and S. S. Woo, 'High Filler Loading Technique and Its Effect on the Reliability of Epoxy Molding Compound', Proceedings of 2nd Electronics Packa-ging Technology Conference, p.318, Singapore, Dec. 8-10, 1998
  5. H. Y. Jung, K. S. Moon, K. S. Choi, K. S. Suh, and H. G. Yoon, 'Effect of High Filler Loading on the Reliability of Epoxy Molding Compound for Microelectronic Packaging', J. Microelectronics & Packaging Soci., 6, 51 (1999)
  6. Y. Tanaka and R. S. Bauer, 'Epoxy Resins: Che-mistry and Technology', ed. by C. A. May, chap. 3, Marcel Dekker, Inc., New York, 1988
  7. L. S. Penn and H. Wang, 'Handbook of Com. posites', ed. by S. T. Reters, 2nd ed., chap. 3. Chapman & Hall, London, 1998
  8. Y. C. Chen, W. Y. Chiu, and K. F. Lin, 'Kinetics Study of Imidazole-Cured Epoxy-Phenol Resins', J. Polym. Sci., 37, 3233 (1999)
  9. S. Han, W. G. Kim, H. G. Yoon, and T. J. Moon, 'Kinetic Study of the Effect of Catalysts on the Curing of Biphenyl Epoxy Resin', J. Appl. Polym. Sci., 68, 1125 (1998) https://doi.org/10.1002/(SICI)1097-4628(19980516)68:7<1125::AID-APP10>3.0.CO;2-X
  10. F. Y. C. Boey and W. Qiang, 'Determining the Gel Point of an Epoxy-Hexaanhydro-4-methylphthalic Anhydride (MHHPA) System', Polym. Eng. Sci., 27, 1698 (1987) https://doi.org/10.1002/pen.760272209
  11. H. Y. Kim, 'Chemorheological Study of Biphenyl-Type Epoxy/Phenol Novolac Resin System', chap. 4, Master Thesis, Korea University, 1998
  12. J. Simitzis, A. Stamboulis, D. Tsoros, and N. Mar-takis, 'Kinetics of Curing of Unsaturated Polyesters in the Presence of Organic and Inorganic Fillers', Polym. Int., 43, 380 (1997) https://doi.org/10.1002/(SICI)1097-0126(199708)43:4<380::AID-PI816>3.0.CO;2-3
  13. H. Y. Kim, K. S. Moon, S. Han, I. M. Kim, and H. G. Yoon, 'Chemorheological Study of Biphenyl-Type Epoxy/Phenol Novolac Resin System', Polymer (Korea), 23, 105 (1999)