The Transactions of the Korean Institute of Electrical Engineers C (대한전기학회논문지:전기물성ㆍ응용부문C)

The Korean Institute of Electrical Engineers (대한전기학회)
권호 표지

Fabrication of 3-D Structures by Inclined and Rear-side Exposures

선택적 경사 노광과 후면 노광에 의한 3차원 구조물의 제작

  • Published : 2004.01.01
Download PDF
⟨ Previous Next ⟩

Abstract

3D microstructures with different side-wall angles and different scales are fabricated by both methods of inclined exposure and rear-side exposure at each of selected areas on a same substrate. Conventional methods of inclined exposure are used to make side-walls with a same inclined angle on one substrate and to get a scale error due to front-side exposure through thick photoresist layer, But, by using the proposed method, we are able to fabricate 3D microstructures on a same substrate with various side-wall angles and accurate dimensions as the original design. In the rear-side exposure, UV exposure light reflects from the chromium mask pattern after passing through the thick photoresist layer, resulting in fabrication of well-defined, inclined 3D structures inside the thick photoresist layer.

Keywords

References

  1. O Tabata et al, 'Fabrication of 3-Dimensional Microstructures using Moving Mask Deep X -ray Lithography,' MEMS'01, pp 94-97, 2001 https://doi.org/10.1109/MEMSYS.2001.906487
  2. Jong-Yeon Park, et al., 'Fabrication of 3D MEMS antenna array structure for uncooled IR sensor using MRPBI system and plastic micromachining,' ICEE '02 pp 1444-1448, 2002
  3. Hironobu Sato, et al, 'A Novel fabrication of in-channel 3-D micromesh structure using maskless multi -angle exposure and its microfilter application,' IEEE Proc. MEMS 2003 pp. 223-226, 2003 https://doi.org/10.1109/MEMSYS.2003.1189726
  4. Yong- Kyu Yoon, et al, 'Integrated vertical screen microfilter system using inclined SU-8 structures,' IEEE Proc. MEMS 2003 pp. 227-230, 2003 https://doi.org/10.1109/MEMSYS.2003.1189727
  5. 김종오, 최연익, '실리콘의 비등방성 부식에 있어서 하부부식에 대한 실험적 고찰,' 아주대학교 논문집 제10권 pp. 21-31, Feb. 1988
  6. Ehrfeld, W. Gotz, F. Munchmeyer, D. Schelb, W. Schmidt, D., 'LIGA process: sensor construction techniques via X -ray lithography,' Solid-State Sensor and Actuator Workshop, 1988. Technical Digest., IEEE, pp 1-4, Iun 1988 https://doi.org/10.1109/SOLSEN.1988.26418
  7. Eugene hecht, 'Optics,' Addison-Wesley, pp 420-421, 1998