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Stability of Sputtered Hf-Silicate Films in Poly Si/Hf-Silicate Gate Stack Under the Chemical Vapor Deposition of Poly Si and by Annealing

  • Kang, Sung-Kwan (School of Material Science and Engineering, Stanford University) ;
  • Sinclair, Robert (School of Material Science and Engineering, Stanford University) ;
  • Ko, Dae-Hong (Department of Ceramic Engineering, Yonsei University)
  • Published : 2004.09.01

Abstract

We investigated the effects of SiH$_4$ gas on the surface of Hf-silicate films during the deposition of polycrystalline (poly) Si films and the thermal stability of sputtered Hf-silicate films in poly Si/Hf-silicate structure by using High Resolution Transmission Electron Microscopy (HR-TEM) and X-ray Photoelectron Spectroscopy (XPS). Hf-silicate films were deposited by using DC-mag-netron sputtering with Hf target and Si target and poly Si films were deposited at 600$^{\circ}C$ by using Low Pressure Chemical Vapor Deposition (LPCVD) with SiH$_4$ gas. After poly Si film deposition at 600$^{\circ}C$, Hf silicide layer was observed between poly Si and Hf-silicate films due to the reaction between active SiH$_4$ gas and Hf-silicate films. After annealing at 900$^{\circ}C$, Hf silicide, formed during the deposition of poly Si, changed to Hf-silicate and the phase separation of the silicate was not observed. In addition, the Hf-silicate films remain amorphous phase.

Keywords

References

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