Journal of the Korea Institute of Information and Communication Engineering (한국정보통신학회논문지)

The Korea Institute of Information and Commucation Engineering (한국정보통신학회)
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Design of a New RF Buit-In Self-Test Circuit for Measuring 5GHz Low Noise Amplifier Specifications

5GHz 저잡음 증폭기의 성능검사를 위한 새로운 고주파 Built-In Self-Test 회로 설계

  • 류지열 (애리조나주립대학교 전기공학과) ;
  • 노석호 (안동대학교 전자공학과) ;
  • 박세현 (안동대학교 전자공학과)
  • Published : 2004.12.01
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Abstract

This paper presents a new low-cost RF Built-In Self-Test (BIST) circuit for measuring transducer voltage gain, noise figure and input impedance of 5.25GHz low noise amplifier (LNA). The BIST circuit is designed using 0.18${\mu}{\textrm}{m}$ SiGe technology. The test technique utilizes input impedance matching and output transient voltage measurements. The technique is simple and inexpensive. Total chip size has additional area of about 18% for BIST circuit.

본 논문에서는 5.25GHz 저잡음 증폭기(LNA)에 대해 전압이득, 잡음지수 및 입력 임피던스를 측정할 수 있는 새로운 형태의 저가 고주파 BIST(Built-In Self-Test, 자체내부검사)회로 설계 및 검사 기술을 제안한다. 이러한 BIST 회로는 0.18$\mu\textrm{m}$ SiGe 공정으로 제작되어 있다. 이러한 접근방법은 입력 임피던스 정합과 출력 전압 측정원리를 이용한다. 본 논문에서 제안하는 방법은 측정이 간단하고 비용이 저렴하다는 장점이 있다. BIST 회로가 차지하는 면적은 LNA가 차지하는 전체면적의 약 18%에 불과하다.

Keywords

References

  1. J. -Y. Ryu, B. C. Kim, S. -T. Kim, and V. Varadarajan 'Novel Defect Testing of RF Front End Using Input Matching Meaurement,' 9th IEEE International Mixed-Signal Testing Workshop, vol, 9, pp. 31-34, June 2003
  2. D. Lupea, U. Pursche and H. -J. Jentschel, 'RF-BIST: Loopback Spectral Signature Analysis,' IEEE Proceedings of the 2003 Design, Automation and Test in Europe Conference and Exhibition, pp. 478-483, March 2003
  3. D. Lupea U. Pursche and H.-J. Jentschel, 'Spectral Signature Analysis-BIST for RF Front-Ends,' Advances in Radio Science, pp. 155-160, 2003
  4. J. Dabrowski, 'BiST Model for ICRF-Transceiver Front-End,' 2003 Proceedings of the 18thIEEE International Symposium on DEFECT and FAULT TOLERANCE in VLSI SYSTEMS, pp. 295-302, November 2003
  5. R. Voorakaranam, S. Cherubal and A. Chatterjee, 'A Signature Test Framework for Rapid Production Testing of RF Circuits,' Proceedings of the 2002 Design, Automation and Test in Europe Conference and Exhibition, pp. 186-191, March 2003
  6. B. R. Veillette and G. W. Roberts, 'A Built-in Self-Test Strategy for Wireless Communication Systems,' Proceedings of the 1995 International Test Conference, pp. 930-939, October 1995
  7. E. P.Vandamme, M. P. Schreurs, and C. van Dinther, 'Improved Three-Step De-Embedding Method to Accurately Account for the Influence of Pad Parasitics tn Silicon On-Wafer RF Test-Structures,'IEEE Tran. Electronic Devices, Vol. 48, No. 4, pp. 137-142, April 2001
  8. K. C. Craig, S. P. Case, R. E. Neese and C. D. DePriest, 'Current and Future Trusting in Automated RF and Microwave Testtng,' IEEE, pp. 183-, 1994