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Silicon Intrinsic Gettering Technology: Understanding and Practice

실리콘 Intrinsic Gettering 기술의 이해와 응용

  • 최광수 (수원대학교 공과대학 전자재료공학과)
  • Published : 2004.01.01

Abstract

Metallic impurities, such as Fe, Cu, and Au, become generation and recombination centers for minority carriers when combined with oxide precipitates or silicon self-interstitial clusters. As these centers may cause leakage and discharge in silicon devices, their prevention through gettering of the metallic impurities is an important issue. In this article, key aspects of intrinsic gettering, such as oxygen control, wafer cleaning, device area denudation, and bulk oxygen precipitation are discussed, and a practical method of implementing intrinsic gettering is outlined.

Keywords

References

  1. A. A. Istratov and E. R. Weber, J. Electrochem. Soc, 149(1), G21 (2002) https://doi.org/10.1149/1.1421348
  2. S. Isomae, H. Ishida, T. Itoga, and K. Hozawa, J. Electrochem. Soc. 149(6), G343 (2002) https://doi.org/10.1149/1.1475694
  3. H. Vainola, M. Yli-Koski, A. Haarahiltunen, and J. Sinkkonen, J. Electrochem. Soc, 150(12), G790 (2003) https://doi.org/10.1149/1.1624845
  4. P. K. Chaterjee, G. W. Taylor, A. F. Tasch Jr. and H.-S. Fu, IEEE Trans. Elec. Dev., 26, 564 (1979) https://doi.org/10.1109/T-ED.1979.19461
  5. R. A. Craven, Semiconductor International (Sept. 1985) p. 134
  6. ASTM Standard F121, 1988 Annual Book of ASTM Standards, Am. Soc. Test. Mat., Philadelphia (1988)
  7. J. Andrews, Defects in Silicon, p. 133, ed. W. M. Bullis and L. C. Kimerling, Electrochem. Soc, Pennington, NJ (1983)
  8. Y. Itoh and T. Nozaki, Jpn, J. Appl. Phys., 24, 279 (1985) https://doi.org/10.1143/JJAP.24.279
  9. M. Stavola, J. R. Patel, L. C. Kimerling and P. E. Freeland, Appl. Phys. Lett., 42, 73 (1983) https://doi.org/10.1063/1.93731
  10. N. Inoue, K. Wada and J. Osaka, Semiconductor Silicon 1981, p. 282, ed. H. R. Huff, R. J. Kriegler and Y. Takeishi, Electrochem. Soc., Pennington, NJ (1981)
  11. J. O. Borland, Semiconductor International (May 1989) p. 154
  12. F. S. Ham, J. Phys. Chem. Solids, 6, 335 (1958) https://doi.org/10.1016/0022-3697(58)90053-2
  13. J. Leroueille, Phys. Stat. Sol. (a) 67, 177 (1981) https://doi.org/10.1002/pssa.2210670117
  14. S. Kishino, Y. Matsushita and M. Kanamori, Appl. Phys. Lett. 35(3), 213 (1979) https://doi.org/10.1063/1.91098
  15. H. J. Hrostowski and R. H. Kaiser, J. Phys. Chem. Solids, 9, 214 (1959) https://doi.org/10.1016/0022-3697(59)90099-X
  16. K. H. Yang, J. Electrochem. Soc, 131, 1140 (1984) https://doi.org/10.1149/1.2115767
  17. D. Burkman, Semiconductor International (July 1981) p. 103
  18. S. M. Sze, Physics of Semiconductor Devices, 2nd ed., p. 35, John Wiley and Sons, NY (1981)
  19. W. Kern, RCA Review, 207 (June 1970)
  20. D. Lafeuille, D. Roche and E. M. Juleff, Solid State Tech., 18, 43 (1975)

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