Journal of the Korean Wood Science and Technology
- 제32권1호
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- Pages.80-87
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- 2004
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- 1017-0715(pISSN)
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- 2233-7180(eISSN)
분말상 탄닌수지를 이용한 파티클보드 제조기술 및 물성개선
Improvement of Particleboard Manufacturing Process and its Properties Using Powdered Tannin Adhesives
- Kang, Seog Goo (Department of Forest Products, Chungnam National University) ;
- Lee, Hwa Hyoung (Department of Forest Products, Chungnam National University)
- 투고 : 2003.07.24
- 심사 : 2003.10.29
- 발행 : 2004.01.25
초록
천연접착제인 분말상 탄닌수지를 사용한 파티클보드의 물리·기계적 성질의 개선을 위하여 분말상 탄닌수지와 액상 탄닌수지를 혼합하여 사용한 결과, 30:70 (분말 : 액상)의 혼합비가 최적조건이었으며 분말상 탄닌 수지의 비율이 높으면 물성이 저하되는 현상을 볼 수 있었으며 또한 포름알데히드 방산량이 E0 수준의 고내수성 제품을 제조할 수 있었다. 한편 요소수지 및 멜라민수지와 분말상 탄닌 수지와의 혼합방법은 물리·기계적 성질의 개선에 영향을 주지 못했으며, 유리포름알데히드 방산에 대한 scavenger의 역할만을 하였다.
This study was carried out to improve the properties of powdered tannin adhesive(PT) by adding liquid tannin resin(LT) to PT in the manufacture of particleboard. Mixing the LT to PT from 50% to 100% by weight did not show any difference in particleboard properties, but the higher the powdered tannin resin ratio, the lower the properties of the board. The proper ratio of PT to LT was 30:70 for the improvement of PT-particleboard, unless LT lower than 70%. Internal bonding strength was in proportional to the amount of LT. Mixing amino adhesives and PT did not show any improvements in mechanical and physical properties of the board but they only acted as scavenger for the free formaldehyde.Manufacturing particle board with the adhesive of 30:70 (PT:LT) and by using double blender resulted in high-performance products of E0 level of formaldehyde emission with high water resistance (U type; below 12%, M type; below 25%), as well as saving chip drying energy.
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