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Degradation of Soft Magnetic Properties of Fe-Hf-N/Cr/SiO2 Thin Films Reacted with Bonding Glass

접합유리와 반응된 Fe-Hf-N/Cr/SiO2 박막의 연자기 특성 열화

  • 제해준 (한국과학기술연구원 재료연구부) ;
  • 김병국 (한국과학기술연구원 재료연구부)
  • Published : 2004.11.01

Abstract

The degradation mechanism of soft magnetic properties of $Fe-Hf-N/Cr/SiO_2$ thin films reacted with a bonding glass was investigated. When $Fe-Hf-N/Cr/SiO_2$ films were annealed under $600^{\circ}C$ without the bonding glass, the compositions and the soft magnetic properties of Fe-Hf-N layers were not changed. However, after reaction with the bonding glass at $550^{\circ}C$, the soft magnetic properties of the film were degraded. At $600^{\circ}C$, the saturation magnetization of the reacted film decreased to 13.5 kG, and its coercivity increased to 4 Oe, and its effective permeability decreased to 700. It was founded that O diffused from the glass into the Fe-Hf-N layers during the reaction and generated $HfO_2$ phases. It was considered that the soft magnetic properties of the $Fe-Hf-N/Cr/SiO_2$ films reacted with the bonding glass were primarily degraded by the formation of the Fe-Hf-O-N layer of which the Fe content was below 60 $at\%$, and secondarily degraded by the Fe-Hf-O-N layer above 70 $at\%$.

Keywords

References

  1. O. Kohmoto, IEEE Trans. Magn., 27(4), 3640 (1991) https://doi.org/10.1109/20.102934
  2. S. Wang and M. H. Kryder, J. Appl. Phys., 67(9), 5134 (1990) https://doi.org/10.1063/1.344665
  3. M. Takahashi, H. Shoji, T. Shimatsu, H. Komaba and T. Wakiyama, IEEE Trans. Magn., 26(5), 1503 (1990) https://doi.org/10.1109/20.104425
  4. T. K. Kim and M. Takahashi, Appl. Phys. Lett., 20(12), 492 (1972) https://doi.org/10.1063/1.1654030
  5. Y. Sugita, H. Takahashi, M. Komuro, K. Mitsuoka and A. Sakuma, J. Appl. Phys., 70(9), 5977 (1991) https://doi.org/10.1063/1.350067
  6. C. Gao, W. D. Doyle and M. Shamsuzzoha, J. Appl. Phys., 73(10), 6579 (1993) https://doi.org/10.1063/1.352570
  7. H. J. Ryu, J. J. Lee, S. H. Han, H. J. Kim, I. K. Kang and J. O. Choi, IEEE Trans. Magn., 31(6), 3868 (1995) https://doi.org/10.1109/20.489799
  8. J. O. Choi, J. J. Lee, S. H. Han, H. J. Kim and I. K. Kang, J. Appl. Phys., 75(10), 5785 (1994) https://doi.org/10.1063/1.355562
  9. K. Terunuma, M. Miyazaki, H. Kawashima and K. Terazono, J. Magn. Soc. Jpn., 14, 257 (1990) https://doi.org/10.3379/jmsjmag.14.257
  10. K. Nakanishi, O. Shimizu and Y. Yoshida, J. Magn. Soc. Jpn., 15, 369 (1991)
  11. K. I. Kim, B. H. Kim, B. K. Kim and H, J, Je, J. Kor. Magn, Soc., 10(8), 165 (2000)
  12. K. N. Kim, B. H. Kim and H, J, Je, J. Kor. Magn, Soc., 13(1), 6 (2003) https://doi.org/10.4283/JKMS.2003.13.1.006
  13. G, Herzer, IEEE Trans. Magn., 26(5), 1397 (1990) https://doi.org/10.1109/20.104389
  14. J. Y. Park, J. Y. Kim, K. Y. Kim, S. H. Han and H. J. Kim, J. Kor. Magn, Soc., 7(5), 237 (1997)