Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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A Study on the Metallic ion Migration Phenomena of PCB

PCB의 금속 이온 마이그레이션 현상에 관한 연구

  • Hong Won Sik (Reliability and Failure Analysis Center, Korea Electronics Technology Institute, Department of Materials Engineering, Hankuk Aviation University) ;
  • Kang Bo-Chul (Reliability and Failure Analysis Center, Korea Electronics Technology Institute) ;
  • Song Byeong Suk (Reliability and Failure Analysis Center, Korea Electronics Technology Institute) ;
  • Kim Kwang-Bae (Department of Materials Engineering, Hankuk Aviation University)
  • 홍원식 (전자부품연구원 신뢰성평가센터, 한국항공대학교 항공재료공학과) ;
  • 강보철 (전자부품연구원 신뢰성평가센터) ;
  • 송병석 (전자부품연구원 신뢰성평가센터) ;
  • 김광배 (한국항공대학교 항공재료공학과)
  • Published : 2005.01.01
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Abstract

Recently a lots of problems have observed in high densified and high integrated electronic components. One of them is ion migration phenomena, which induce the electrical short of electrical circuit. ion migration phenomena has been observed in the field of exposing the specific environment and using for a long tin e. This study was evaluated the generation time of ion migration and was investigated properly test method through water drop test and high temperature high humidity test. Also we observed direct causes and confirmed generation mechanism of dendritic growth as we reproduced the ion migration phenomena. We utilized PCB(printed circuit board) having a comb pattern as follows 0.5, 1.0, 2.0 mm pattern distance. Cu, SnPb and Au were electroplated on the comb pattern. 6.5 V and 15 V were applied in the comb pattern and then we measured the electrical short time causing by ion migration. In these results, we examined a difference of ion migration time depending on pattern materials, applied voltage and pattern spacing of PCB conductor.

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References

  1. The Institute for Interconnecting and Packaging Electronic Circuit, IPC-TR-476A Electrochemical Migration (1997)
  2. The Institute for Interconnecting and Packaging Electronic Circuit, IPC-TM-650 Test Methods Manual (1973)
  3. M. G. Fontana, Corrosion Engineering, 3rd ed., p.41, M. B. Bever, McGraw-Hill, New York, (1987)
  4. Y. Kin, ESPEC Technology Report, 2, 1 (1996)
  5. H. Tanaka, Y. Aoki and S. Yamamoto, Espec Technology Report, 4, 10 (1997)
  6. T. Ohtori, J. of Jpn. Inst. Interconnecting and Packaging Electronic Circuits, 10(2), 80 (1995) https://doi.org/10.5104/jiep1995.10.80
  7. Y. Aoki, H. Tanaka, S. Yamamoto and O. Obata, Espec Technology Report, 1, 16 (1996)
  8. S. J. Krumbein. IEEE Trans. Relr, 44, 539 (1995) https://doi.org/10.1109/24.475971
  9. H. Tanaka, H. Hiramatsu, K. Kumekkawa, F. Ueta, S. Yoshihara and T. Shirakashi, J. of Jpn. Inst. Electronics Packaging, 5(2), 188 (2002) https://doi.org/10.5104/jiep.5.188