Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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The Effect of Dual Wafer Back-Lapping Process on Flexural Strength of Semiconductor Chips

웨이퍼의 2단 이면공정이 반도체 칩의 휨 강도에 미치는 영향

  • Lee Seong Min (Department of Materials Science & Engineering, University of Incheon)
  • 이성민 (인천대학교 신소재공학부)
  • Published : 2005.03.01
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Abstract

It was studied in this article how the flexural strength of bare silicon chips is influenced by adopting dual wafer back-lapping process. The experimental results showed that an additional finishing process after the conventional grinding process improves the flexural strength of bare chips by more than 2-fold. In particular, this work showed that the proper removal of the grinding marks$(Ra=0.1\;{\mu}m)$existing on the wafer back-surface resulting from the grinding process significantly contiributes to the enhancement of chip strength.

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References

  1. D. Broek, Elementary Engineering Fracture Mechanics, 170 (1983)
  2. J.H. Lau, Thermal Stress and Strain in Microelectronics Packaging, 422 (1993)
  3. G. Hawkins, H. Berg, M. Mahalingam, G. Lewis, Lofgran, Pro. 25th Int. Reliability Phys. Symp., IEEE, 216 (1987)
  4. T.B. Lim, Proc. 25th Int. Reliability Phys. Symp., IEEE, 131 (1989)
  5. M. Nishiguchi, N. Goto and H. Nishizawa, IEEE CPMT, 14, 523 (1991)
  6. K. Mizuishi, M. Tokuda and Y. Fujita, IEEE CPMT, 11, 447 (1988)
  7. R. P. Vidano, D. W. Paananen, T. H. Miers, J. M. Krause-Singh, K. R. Agricola and R. L. Hauser, IEEE CPMT, 12, 612 (1987)
  8. M. Nishiguchi N. Goto, T. Sekiguchi, H. Nishizawa, H. Hayashi and K. Ono, IEEE CPMT, 13, 528 (1990)
  9. S. M. Lee, S. M. Sim, T. W. Chung, Y. K. Jang and H. K. Cho, JJAP Part 1, 6A, 3374 (1997) https://doi.org/10.1143/JJAP.36.3374
  10. M. G. Pecht, L. T. Nguyen and E. B. Hakin, PlasticEncapsulated Microelectronics (John Wiley and Sons, Inc., 1995) 242