Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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Effect of Alanine on Cu/TaN Selectivity in Cu-CMP

Cu-CMP에서 Alanine이 Cu와 TaN의 선택비에 미치는 영향

  • Park Jin-Hyung (Nano-SOI Process Laboratory, Hanyang University) ;
  • Kim Min-Seok (Nano-SOI Process Laboratory, Hanyang University) ;
  • Paik Ungyu (Department of Ceramic Engineering, Hanyang University) ;
  • Park Jea-Gun (Nano-SOI Process Laboratory, Hanyang University)
  • 박진형 (Nano-SOI 공정 연구실, 한양대학교) ;
  • 김민석 (Nano-SOI 공정 연구실, 한양대학교) ;
  • 백운규 (세라믹공학과, 한양대학교) ;
  • 박재근 (Nano-SOI 공정 연구실, 한양대학교)
  • Published : 2005.06.01
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Abstract

Chemical mechanical polishing (CMP) is an essential process in the production of integrated circuits containing copper interconnects. The effect of alanine in reactive slurries representative of those that might be used in copper CMP was studied with the aim of improving selectivity between copper(Cu) film and tantalum-nitride(TaN) film. We investigated the pH effect of nano-colloidal silica slurry containing alanine through the chemical mechanical polishing test for the 8(inch) blanket wafers as deposited Cu and TaN film, respectively. The copper and tantalum-nitride removal rate decreased with the increase of pH and reaches the neutral at pH 7, then, with the further increase of pH to alkaline, the removal rate rise to increase soddenly. It was found that alkaline slurry has a higher removal rate than acidic and neutral slurries for copper film, but the removal rate of tantalum-nitride does not change much. These tests indicated that alanine may improve the CMP process by controlling the selectivity between Cu and TaN film.

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References

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