한국정밀공학회지 (Journal of the Korean Society for Precision Engineering)

  • 제22권7호
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  • Pages.137-145
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  • 2005
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  • 1225-9071(pISSN)
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  • 2287-8769(eISSN)
한국정밀공학회 (Korean Society for Precision Engineering)
권호 표지

와이어 본더 시스템의 Z축 표면 접촉 검출 알고리듬 개발

Contact Detection Algorithm of the Z-axis of a Wire Bonder

  • 김정한 (서울산업대학교 기계설계자동화공학부 정밀기계기술연구소)
  • 발행 : 2005.07.01
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초록

A new design of contact detection algorithm is proposed for the z-axis of a wire bonder that interconnects between pads and leads in semiconductor manufacturing processes. Fast and stable contact detection of the z-axis is extremely important fer maintaining proper quality in the fine pitch gold wire bonding process, which has a small pad size of below 70um. The new method is based on a statistical approach and designed for the discrete Kalman filter. Real wire bonding experimental results are presented to demonstrate the advantages of the proposed algorithm.

키워드

참고문헌

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