Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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A Study on the Improvement of Adhesion according to the Process Variables of Ion Beam in the Cu/Polyimide Thin Film

이온빔의 공정변수에 따른 Cu/Polyimide 박막의 접착력향상에 관한 연구

  • Shin Youn-Hak (Department of Materials Engineering, Chungbuk National University) ;
  • Kim Myung-Han (Department of Materials Engineering, Chungbuk National University) ;
  • Choi Jae-Ha (Department of Materials Engineering, Chungbuk National University)
  • 신윤학 (충북대학교 공과대학 재료공학과) ;
  • 김명한 (충북대학교 공과대학 재료공학과) ;
  • 최재하 (충북대학교 공과대학 재료공학과)
  • Published : 2005.07.01
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Abstract

In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer surfaces by ion beam irradiation and rf plasma is commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $N_2^+$ ion beam irradiation conditions for pretreatment. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the 90° peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $N_2^+$ ion beam irradiation energy at the fixed metal-layer thickness.

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