Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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The behavior of WO3 Thin Film on NiO Addition

NiO를 첨가한 WO3 박막의 미세 구조 거동

  • Kim Gwang-Ho (Department of Materials science and Engineering, Chosun University) ;
  • Na Dong-Myong (Department of Materials science and Engineering, Chosun University) ;
  • Choi Gwang-Pyo (JAMIC, Sunchun, Jeonnam) ;
  • Park Jin-Seong (Department of Materials science and Engineering, Chosun University)
  • 김광호 (조선대학교 신소재공학과) ;
  • 나동명 (조선대학교 신소재공학과) ;
  • 최광표 (전남 신소재기술산업화 지원센터) ;
  • 박진성 (조선대학교 신소재공학과)
  • Published : 2005.07.01
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Abstract

Thin films of tungsten oxide and nickel oxide were deposited on $Al_2O_3/Si-substrate$ by high vacuum thermal evaporation. The properties of microstructure and crystallinity were analyzed by SEM and XRD respectively. $WO_3$ films without addition of NiO showed polycrystalline structure after annealing at $500^{\circ}C$ for SO min. There were the cracks between the polycrystalline grains and the crack width was increased with the thickness of $WO_3$ films. The cracks in the $WO_3$ films could be controlled by an optimum deposition of NiO on $WO_3$ films and either less or more than the optimum addition fails to suppress the cracks. A process mechanism to suppress the crack has been discussed.

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References

  1. T. Seiyama, A. Kato, K. Fujishi and M. Nagatani, Anal. Chem., 34, 1502 (1962) https://doi.org/10.1021/ac60191a001
  2. J. S. Suehl, R. Z. Cavicchi, M. Gaiton and S. Semancik, IEEE Electron Device Letters, 14, 118 (1993) https://doi.org/10.1109/55.215130
  3. X. Q. XU, H. Shen and X. Y. Xiang, Thin Solid Films, 415, 290 (2002) https://doi.org/10.1016/S0040-6090(02)00544-8
  4. C. Salinga, H. Weis and M. Wutting, Thin Solid Films, 414, 282 (2002)
  5. M. Stolze, B. Camin, T. Galbert, U. Reinholz and L. K. Thomas, Thin Solid Film, 409, 254 (2002) https://doi.org/10.1016/S0040-6090(02)00058-5