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Characterization of Subsurface Damage in Si3N4 Ceramics with Static and Dynamic Indentation

  • Kim, Jong-Ho (Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology) ;
  • Kim, Young-Gu (Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology) ;
  • Kim, Do-Kyung (Samsung Electronics)
  • Published : 2005.08.01

Abstract

Silicon nitride is one of the most successful engineering ceramics, owing to a favorable combination of properties, including high strength, high hardness, low thermal expansion coefficient, and high fracture toughness. However, the impact damage behavior of $Si_3N_4$ ceramics has not been widely characterized. In this study, sphere and explosive indentations were used to characterize the static and dynamic damage behavior of $Si_3N_4$ ceramics with different microstructures. Three grades of $Si_3N_4$ with different grain size and shape, fine-equiaxed, medium, and coarse-elongated, were prepared. In order to observe the subsurface damaged zone, a bonded-interface technique was adopted. Subsurface damage evolution of the specimens was then characterized extensively using optical and electron microscopy. It was found that the damage response depends strongly on the microstructure of the ceramics, particularly on the glassy grain boundary phase. In the case of static indentation, examination of subsurface damage revealed competition between brittle and ductile damage modes. In contrast to static indentation results, dynamic indentation induces a massive subsurface yield zone that contains severe micro-failures. In this study, it is suggested that the weak glassy grain boundary phase plays an important role in the resistance to dynamic fracture.

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