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냉간 등방압 성형기를 이용한 미세박판 인장시편의 가공 및 기계적 물성측정 기술

Manufacturing Technology of Thin Foil Tensile Specimen Using CIP and Mechanical Property Measurement Technology

  • 이낙규 (한국생산기술연구원 생산기반기술본부) ;
  • 박훈재 (한국생산기술연구원 생산기반기술본부) ;
  • 김승수 (한국생산기술연구원 생산기반기술본부) ;
  • 이형욱 (한국생산기술연구원 생산기반기술본부) ;
  • 황재혁 (한국항공대학교 항공우주 및 기계공학부) ;
  • ;
  • 이혜진 (한국생산기술연구원)
  • 발행 : 2005.09.01

초록

This paper is concerned with manufacturing technology of thin foil tensile specimen using CIP(Cold Isostatic Press) and measurement of precision mechanical properties using micro tensile testing. We can get a burr free micro metallic thin foil specimen using this technology. For testing mechanical property of this micro thin foil, we use a nano scale material testing machine that was developed by KITECH. In this paper, micro tensile specimens of nickel and copper thin foil are fabricated with CIP and precision mechanical properties of these materials could be measured. We will expect precision mechanical property of micro/nano material and component.

키워드

참고문헌

  1. Y. A. Jeon, K. S. No, J. S. Kim, Y. S. Yoon, 2003, Characteristics of ZnO thin film deposited on various metal bottom electrodes, Metals and Materials Int., vol. 9, no. 4, pp. 383-387 https://doi.org/10.1007/BF03027192
  2. S. Greek, S. Johansson, 1997, Tensile testing of thin film microstructures, Proc. SPIE, vol. 3224, pp. 344-351
  3. T. Tsuchiya, O. Tobato, J. Sakata, Y. Taga, 1998, Specimen size effect on tensile strength of surfacemicromachined polycrystalline silicon thin films, J. Microelectromech. Syst., vol. 7, pp. 106-113 https://doi.org/10.1109/84.661392
  4. H. Ogawa, K. Susuki, S. Kaneko, Y. Nakano, Y. Ishikawa, T. Kitahara, 1997, Measurement of mechanical properties of micro fabricated thin film, Proc. IEEE Micro Electro Mechanical Systems Workshop, pp. 430-435
  5. I. Chasiotis, W. Knauss, 1998, Mechanical properties of thin polysilicon films by means of probe microscopy, Proc. SPIE, vol. 3512, pp. 66-75
  6. W. N. Sharpe Jr., 1989, An interferometric strain/displacement measurement system, NASA Technical Memorandum 101638
  7. W. N. Sharpe Jr., B. Yuan, R. L. Edwards, 1997, A new technique for measuring the mechanical properties of thin films, J. Microelectromech. Syst., vol. 6, pp. 193-199 https://doi.org/10.1109/84.623107
  8. W. N. Sharpe Jr., D. A. LaVan, R. L. Edwards, 1997, Mechanical properties of LIGA-deposited nickel for MEMS transducers, Proc. Int. Conf. Solid-State Sensors and Actuators, pp. 607-610
  9. T. Yi, C. J. Kim, 1999, Microscale material testing: etchant effect on the tensile strength, Proc. Int. Conf. Solid-State Sensors and Actuators, pp. 518-521
  10. T. Yi, Lu Li, C. J Kim, 2000, Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength, Sensors and Actuators A: Physical, vol. 83, Issues 1-3, pp. 172-178 https://doi.org/10.1016/S0924-4247(00)00350-2