Journal of the Korean Ceramic Society (한국세라믹학회지)

The Korean Ceramic Society (한국세라믹학회)
권호 표지
DOI QR코드

DOI QR Code

Fabrication of a (100) Silicon Master Using Anisotropic Wet Etching for Embossing

  • Jung, Yu-Min (Department of Materials Engineering Korea University of technology and Education) ;
  • Kim, Yeong-Cheol (Department of Materials Engineering Korea University of Technology and Education)
  • Published : 2005.10.01
Download PDF
⟨ Previous Next ⟩

Abstract

To fabricate a (100) silicon hard master, we used anisotropic wet etching for the embossing. The etching chemical for the sili­con wafer was a TMAH 25$\%$ solution. The anisotropic wet etching produces a smooth sidewall surface inclined at 54.7°, and the surface roughness of the fabricated master is about 1 nm. After spin coating an organic-inorganic sol-gel hybrid resin on a silicon substrate, we used the fabricated master to form patterns on the silicon substrate. Thus, we successfully obtained patterns via the hot embossing technique with the (100) silicon hard master. Moreover, by using a single hydrophobic surface treatment of the master, we succeeded in achieving uniform surface roughness of the embossed patterns for more than ten embossments.

Keywords

References

  1. N. Savage, 'Linking with Light,' IEEE Spectrum, 39 [8] 32-6 (2002)
  2. W. S. Kim, J. H. Lee, S. Y. Shin, B. S. Bae, and Y. C. Kim, 'Fabrication of Ridge Waveguides by UV Embossing and Stamping of Sol-Gel Hybrid Materials,' IEEE Photonics Technol. Lett., 16 [8] 1888-90 (2004) https://doi.org/10.1109/LPT.2004.831053
  3. M. Hikita, S. Tomaru, K. Enbutsu, N. Ooba, R. Yoshimura, M. Usui, T. Yoshida, and S. Imamura, 'Polymeric Optical Waveguide Films for Short-Distance Optical Interconnects,' IEEE J., 5 [5] 1237-42 (1999)
  4. M. T. Gale, C. Gimkiewicz, S. Obi, M. Schnieper, J. Sochitg, H. Thiele, and S. Westenhofer, 'Replication Technology for Optical Microsystems,' Optics and Lasers in Eng., 43 [3-5] 373-86 (2005) https://doi.org/10.1016/j.optlaseng.2004.02.007
  5. S. Y. Chou, P. R. Krauss, and P. J. Rennstrom, 'Nanoim¬print Lithography,' J. Vac. Sci. Tech. B, 14 [6] 4129-33 (1996) https://doi.org/10.1116/1.588605
  6. S. Y. Chou, P. R. Krauss, W. Zhang, L. Guo, and L. Zhang, 'Sub-10 nm Imprint Lithography and Applications,' J. Vac. Sci. Tech. B, 15 [6] 2897-904 (1997) https://doi.org/10.1116/1.589752
  7. T. Bailey, B. J. Choi, M. Colburn, M. Meissl, S. Shaya, J. G. Ekerdt, S. V. Sreenivasan, and C. G. Willson, 'Step and Flash Imprint Lithography: Template Surface Treatment and Defect Analysis,' J. Vac. Sci. Tech. B, 18 [6] 3572-77 (2000) https://doi.org/10.1116/1.1324618
  8. C. Park, J. Yoon, and E. L. Thomas, 'Enabling Nanotechnology with Self Assembled Block Copolymer Patterns,' Polymer, 44 [22] 6725-60 (2003) https://doi.org/10.1016/j.polymer.2003.08.011
  9. Y. Xia and G. M. Whitesides, 'Soft Lithography,' Angew. Chem., Int. Ed., 37 [5] 550-75 (1998) https://doi.org/10.1002/(SICI)1521-3773(19980316)37:5<550::AID-ANIE550>3.0.CO;2-G

Cited by

  1. Anisotropic Wet-Etching Process of Si Substrate for Formation of Thermal Vias in High-Power LED Packages vol.19, pp.4, 2012, https://doi.org/10.6117/kmeps.2012.19.4.051