Transactions of the Korean Society of Mechanical Engineers B (대한기계학회논문집B)

The Korean Society of Mechanical Engineers (대한기계학회)
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A Study of Cooling of Mobile Phone Using PCM Module

상변화 물질을 이용한 이동전화기의 냉각에 관한 연구

  • 이상진 (한양대학교 대학원 기계공학과) ;
  • 정수진 (한중대학교 자동차공학과) ;
  • 김우승 (한양대학교 기계공학과)
  • Published : 2005.11.01
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Abstract

The cooling effect of a mobile phone using PCM(Phase Change Material) module has been numerically investigated. A transient three-dimensional numerical analysis of heat and fluid flow with natural convection is performed in this study. Governing conservation equations for mass, momentum and energy are solved by an implicit finite volume method. An enthalpy-porosity technique has been used for modeling of the melting process. Two different ways of placing the PCM module are considered. One is to place a PCM module between the substrate and battery pack, and the other is to place a PCM module between MCM(multichip module) and battery pack. Three different types of PCMs are used to predict the performance of PCM. The results show that passive cooling with PCM can reduce the temperature rise and the effect of natural convection in PCM module considered in this study is negligible.

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References

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