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Tafel Characteristics by Electrochemical Reaction of SnAgCu Pb-Free Solder

SnAgCu계 무연솔더의 전기화학적 반응에 따른 타펠 특성

  • Hong Won Sik (Department of Materials Engineering, Hankuk Aviation University, Reliability and Failure Analysis Center, Korea Electronics Technology Institute) ;
  • Kim Kwang-Bae (Department of Materials Engineering, Hankuk Aviation University)
  • 홍원식 (한국항공대학교 항공재료공학과, 전자부품연구원 신뢰성평가센터) ;
  • 김광배 (한국항공대학교 항공재료공학과)
  • Published : 2005.08.01

Abstract

Recently European Council(EU) published the RoHS(restriction of the use of certain hazardous substances in electrical and electronic equipment) which is prohibit the use of Pb, Hg, Cd, $Cr^{+6}$, PBB or PBDE in the electrical and electronic equipments. So EU member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain 6 hazardous substances. The one of the most important in electronics manufacturing process is soldering. Soldering process use the chemical substances which are applied in fluxing and cleaning processes and it can generate the malfunction of electronics caused by corrosion in the fields conditions. Therefore this study researched on the polarization and Tafel properties of Sn40Pb and Sn3.0Ag0.5Cu(SAC) solder based on the electrochemical theory. We prepared SnPb specimens which was aged in $150^{\circ}C,\;180^{\circ}C$ for 15 minutes ana Sn3.0Ag0.5Cu specimens that was aged in $180^{\circ}C,\;220^{\circ}C$ for 10 minutes. Experimental polarization curves were measured in distilled ionized water and $3.5 wt\%$, 1 mole NaCl electrolyte of $40^{\circ}C$, pH 7.5. Ag/AgCl and graphite were utilized by reference and counter electrode, respectively. To observe the electrochemical reaction, polarization test was conducted from -250 mV to +250 mV. From the polarization curves that were composed of anodic and cathodic curves, we obtained Tafel slop, reversible electrode potential(Ecorr) and exchange current density(Icorr). In these results, corrosion rate for two specimen were compared Sn3.0Ag0.5Cu with SnPb solders

Keywords

References

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  2. Chemical use in the semiconductor manufacturing industry pp.2049-3967, 2018, https://doi.org/10.1080/10773525.2018.1519957