한국정밀공학회지 (Journal of the Korean Society for Precision Engineering)

  • 제22권4호
  • /
  • Pages.167-172
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  • 2005
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  • 1225-9071(pISSN)
  • /
  • 2287-8769(eISSN)
한국정밀공학회 (Korean Society for Precision Engineering)
권호 표지

디스크 전극을 이용한 미세 전해 밀링 가공에서의 테이퍼 형상 방지

Taper Reduction in Micro Electrochemical Milling Using Disk-type Electrode

  • 김보현 (서울대학교 기계항공공학부) ;
  • 이영수 (서울대학교 기계항공공학부) ;
  • 최덕기 (강릉대학교 정밀기계공학부) ;
  • 주종남 (서울대학교 기계항공공학부)
  • 발행 : 2005.04.01
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초록

In this paper. micro electrochemical machining (ECM) for micro structure fabrications is presented. By applying ultra short pulses. the chemical reaction can be restricted only to the region very close to the electrode. Micro ECM is applied to machining micro structures through electrochemical milling process becasuse it doesn't suffer from tool wear. Using this method. 3D micro structures were machined on stainless steel. It was found that micro machining is possible with good surface quality in the low concentration electrolyte,0.1 M H₂SO₄. In ECM, as the machining depth increases, better flushing of electrolyte is required for sufficient ion supply. Layer-by-layer milling is advantageous in flushing. However, layer-by-layer milling causes taper of structures. To reduce the taper, application of a disk-type electrode was introduced. By electrochemical milling, various 3D micro structures including a hemisphere with 60 ㎛ diameter were fabricated.

키워드

참고문헌

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