Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)
- Volume 4 Issue 4 Serial No. 13
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- Pages.27-31
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- 2005
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- 1738-2270(pISSN)
Development of Repair FPC Bonder
리페어 FPC 본더 개발
- Ahn Jung-Woo (SFA Eng. Co. of DSP System Institute) ;
- Seo Ji-Weon (SFA Eng. Co. of Clean Equipment Institute)
- Published : 2005.12.01
Abstract
This article contains the development of FPC bonder that used for repair or trial product. Nowadays, in FPO module process (including PDP) accept the thermo-compress bonding method when attach FPC(Flexible Printed Circuit Board), TCP(Tape Carrier Package) and COF(Chip on the FPC) by ACF(Anisotropic Conductive Film). This system consists of ACF attachment part, pre-bonding part, main bonding part, loading / unloading part. This composition is a stand-alone system, not an in-line system. Hereafter, this composition should be developing into in-line system in all area of FPD industry.