The Journal of Korean Institute of Electromagnetic Engineering and Science (한국전자파학회논문지)

The Korean Institute of Electromagnetic Engineering and Science (한국전자파학회)
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Analysis of Via Fence Effects in PCB Transmission Lines

PCB 전송선에서 비아 펜스의 효과 분석

  • Kim Jong-Ho (Department of Radio Science and Engineering Chungnam National University) ;
  • Park Sang-Wook (Department of Radio Science and Engineering Chungnam National University) ;
  • Ju Jae-Cheol (Department of Radio Science and Engineering Chungnam National University) ;
  • Park Dong-Chul (Department of Radio Science and Engineering Chungnam National University)
  • Published : 2005.04.01
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Abstract

In analog and digital electronic systems, crosstalk between transmission lines on the printed circuit board can degrade the performance of equipment operations. This paper presents a technique to analyze the effects of via fence, which is based on additional transmission lines grounded by vias. The technique is composed of a circuit concept approach for transmission line sections md an impedance modeling of via hole sections. All sections are represented by ABCD parameters and they are cascaded. Finally, this technique was verified by comparing the measurement results with the simulation ones.

아날로그 및 디지털 시스템에서 인쇄회로기판에 있는 전송선들의 상호 결합은 장비의 성능을 저하시킬 수 있다. 이 논문에서는 전송선들 사이에 추가로 전송선을 삽입하고 비아 홀을 통해 접지면에 직접 연결시킨 비아펜스의 영향을 해석하기 위한 방법을 제안하였다. 이 방법은 전송선 부분을 위한 회로 개념과 비아 홀 부분을 위한 임피던스 모델링으로 이루어졌고 각 부분을 ABCD 파라미터로 나타내어 직렬 연결하였다. 마지막으로 이 방법에 의한 시뮬레이션 결과를 측정 결과와 비교하여 방법의 타당성을 입증하였다.

Keywords

References

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