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열응력과 잔류응력하의 다층박막의 피로수명 해석

Fatigue Life Analysis on Multi-Stacked Film Under Thermal and Residual Stresses

  • 박준협 (동명정보대학교 메카트로닉스공학과)
  • 발행 : 2005.04.01

초록

Reliability problem in inkjet printhead, one of MEMS devices, is also very important. To eject an ink drop, the temperature of heater must be high so that ink contacting with surface reaches above $280^{o}C$ on the instant. Its heater is embedded in the thin multi-layer in which several materials are deposited. MEMS processes are the main sources of residual stresses development. Residual stress is one of the factors reducing the reliability of MEMS devices. We measured residual stresses of single layers that consist of multilayer. FE analysis is performed using design of experiment(DOE). Transient analysis for heat transfer is performed to get a temperature distribution. And then static analysis is performed with the temperature distribution obtained by heat transfer analysis and the measured residual stresses to get a stress distribution in the structure. Although the residual stress is bigger than thermal stress, thermal stress is more influential on fatigue life.

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참고문헌

  1. Tanner, D. M., Smith, N. F., Bowman, D. J., Eaton, W. P. and Peterson, K. A., 1997, 'First Reliability Test of a Surface Micromachinned Microengine using ShiMMeR,' Proceedings SPIE Symposium on Micromachinning and Microfabrication, Vol. 3224, pp. 14-23
  2. Kolpekwar, A. and Blanton, R. D., 1997, 'Development of a MEMS Testing Methodology,' Proc. International Test Conference IEEE, pp. 923-931 https://doi.org/10.1109/TEST.1997.639707
  3. Tanner, D. M., 2000, 'Reliability of Surface Micromachined MicroElectroMechanical Actuators,' Proc. $22^{nd}$ International Conference on Microelectronics, Vol. 1, pp. 97-104 https://doi.org/10.1109/ICMEL.2000.840535
  4. Rembe, C., Aschemann, H., Wiesche, S., Hofer, E. P., Debeda, H., Mohr, J. and Wallrabe, U., 2000, 'Nontactile Reliability Testing of a Micro Optical Attenuator,' Proc. $38^{th}$ Annual International Reliability Physics Symposium, pp. 123-128 https://doi.org/10.1109/RELPHY.2000.843902
  5. Park, J-. H. and Oh, Y. S., 2004, 'Fatigue Test of MEMS Device: a Monolithic Inkjet Print,' KSME International Journal, Vol. 18, No.5, pp. 816-825
  6. Chang, L.S. and Olive, G., 1987, 'Factors Influencing the Lifetime of Thermal Ink-jet Heaters,' SID International Symposium, Digest of Technical Papers, First Edition, Palisades Inst. Res. Services, pp. 192-195
  7. Chang, L.S., 1989, 'Mechanisms of Failure of Thermal Ink-jet Thin-film Devices under Stressed Conditions,' Journal of the Society for Information Display, Vol. 30, No. 1, pp. 57-63
  8. Usui, M., 1996, 'Development of the New MACH,' Proc. of the $12^{th}$ International Congress on Advances in Non-Impact Printing, pp. 50-53
  9. Kamisuki, S., Fujii, M., Takekoshi, T., Tezuka, C. and Atobe, M., 2000, 'A High Resolution, Electrostatically-Driven Commercial Inkjet Head,' Proc. of IEEE, The $13^{th}$ Annual International Workshop on Micro Electro Mechanical Systems, pp. 793-798 https://doi.org/10.1109/MEMSYS.2000.838619
  10. Tseng, F., Kim, C. J. and Ho, C., 1998, 'A Novel Microinkjector with Virtual Chamber Neck,' Proceedings of IEEE, The 11th Annual International Workshop on Micro Electro Mechanical Systems, pp. 57-62 https://doi.org/10.1109/MEMSYS.1998.659729
  11. Lee, S-. W., Kim, H-. C., Kuk, K. and Oh, Y. S., 2001, 'A Monolithic Inkjet Print Head: DomeJet,' Technical Digest of 14th IEEE International Conference on Micro Electro Mechanical Systems, pp. 515-518 https://doi.org/10.1109/MEMSYS.2001.906592
  12. Krause, P., Obermeier, E. and Wehl, W., 1995, 'Backshooter - A New Smart Micromachined Single-Chip Inkjet Printhead,' Digest of Technical Papers of The $8^{th}$ International Conference on Solid-State Sensors and Actuators, Vol. 2, pp. 325-328 https://doi.org/10.1109/SENSOR.1995.721812