Development on the High Concentration Ozone Generator System for the Semiconductor Photoresist Strip Process

반도체 감광막 제거공정 적용을 위한 고농도 오존발생장치 개발

  • 손영수 (한국기계연구원 지능형정밀기계연구본부) ;
  • 함상용 (한국기계연구원 지능형정밀기계연구본부)
  • Published : 2006.12.01

Abstract

we have been developed on the ultra high concentration ozone generator system which is the core technology in the realization of the semiconductor photoresist strip process using the ozone-vapor chemistry. The proposed ozone generator system has the structure of the surface discharge type which adopt the high purity ceramic dielectric tube. We investigate the performance of the proposed ozone generator system experimentally and the results show that the system has very high ozone concentration characteristics of $19.7[wt%/O_2]$ at the flow rate of $0.3[{\ell}/min]$ of each discharge cell. As a result of the silicon wafer photoresist strip test, we obtained the strip rate of about 400[nm/min] at the ozone concentration of $16[wt%/O_2]$ and flow rate of $8[{\ell}/min]$. So, we confirmed that it's possible to use the proposed high concentration ozone generator system for the ozone-vapor photoresist strip process in the semiconductor and FPD industry.

Keywords

References

  1. Bruno Langlais David A,'Ozone in water treatment; application and engineering', American Water Works Association Research Foundation, 1991
  2. W. Kern, Handbook of Semiconductor Wafer Cleaning Technology, Noyes Publications, Westwood, NJ, 1993, pp.383-391
  3. J. K. Tong, Cleaning Technology in Semiconductor Device Manufacturing, J.Ruzyllo and R.E. Novak, Editors, PV 92-12, p.18, The Electrochemical Society Proceedings Series, Pennington, NJ (1992)
  4. Wei and S. Verhaverbeke, Cleaning Technology in Semiconductor Device Manufacturing V, The Electrochemical Society, Inc., Pennington, NJ, 1998, pp.496-504
  5. 손영수, 채상훈, 'PR제거공정 적용을 위한 오존수 생성 기술 연구', 대한전자공학회 논문지 Vol.41, SD No.12, p.1107-1114, December 2004
  6. S, Nelson, 'Ozonated Water for Wafer Cleaning and Photoresist Removal', Solid State Technology, July, 1999, pp.107-112
  7. J. Cheng, p. Nemeth, 'The Study of Temperature Effect in Photoresist Stripping with DIO3 Process', Technical Report, Akrion, Allentown, PA, April 12, 1999
  8. S.De Gendt, J. Wauters and M. Heyns, 'A novel Resist and Post-Etch Residue Removal Process Using Ozonated Chemistry', Solid State Technology, pp.57-60, December, 1998
  9. Toshikazu Abe, Senji Ojima, 'Photoresist Stripping Using Alkaline Accelerator Containing Wet-Vapor', Solid State Phenomena Vols. 76-77, pp.231-234, 2001 https://doi.org/10.4028/www.scientific.net/SSP.76-77.231
  10. Hitoshi Abe, Hayato Iwamoto, 'Novel Photoresist Stripping Technology Using Ozone/Vapor Water Mixture', IEEE Trans. on semiconductor Manufacturing, Vol.16, No.3, pp 401-408, Aug. 2003 https://doi.org/10.1109/TSM.2003.815620
  11. Moo bean Chang, 'Experimental Study on Ozone Synthesis via Dielectric Barrier Discharge', Ozone Science and Engineering, Vol. 19, pp.241-254, 1997 https://doi.org/10.1080/01919519708547304
  12. 조국희, 이형호, '동축형 전극길이 변화시의 연면무성 방전에 의한 오존발생특성', 대한전기학회논문지 Vol.48C, No.12, pp.791-797, 1999
  13. 손영수, 함상용, '반도체 웨이퍼 오존 수 세정을 위한 고농도 오존발생장치 특성연구', 대한전기학회 논문지 Vol.52C, No.12,pp.579-586, 2003