Post Sliced Cleaning of Silicon Wafers using Ozone and Ultrasound

오존과 초음파를 이용한 실리콘 웨이퍼의 Post Sliced Cleaning

  • Choi, Eun-Suck (Leading Project Team, R & D Center, Siltron Inc.) ;
  • Bae, So-Ik (Leading Project Team, R & D Center, Siltron Inc.)
  • Published : 2006.02.27


The effect of ozone and/or ultrasound treatments on the efficiency of slurry removal in post sliced cleaning (PSC) of silicon ingot was studied. Efficiency of slurry removal was evaluated as functions of time, temperature and surfactant with DOE (Design of Experiment) method. Residual slurries were observed on the wafer surface in case of cleaning by ozone or ultrasound separately. However, a clean wafer surface was appeared when cleaned with ozone and ultrasound simultaneously. It has found that cleaning time was the main effect among temperature, time and surfactant. Elevated temperature, addition of surfactant and high ozone concentration helped to accelerate efficient removal of slurry. The improvement of removal efficiency seems to be related to the formation of more active OH radicals. The highly cleaned surface was achieved at 10 wt% ozone, 1 min and 10 vol% surfactant with ultrasound. Application of ozone and ultrasound might be a useful method for PSC process in wafer cleaning.



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