DOI QR코드

DOI QR Code

Surface Modification and Heat Treatment of Ti Rod by Electro Discharge

전기방전에 의한 Ti rod의 열처리 및 표면개질 특성에 관한 연구

  • Byun, C.S. (Department of Materials Engineering, Hanbat University) ;
  • Oh, N.H. (Department of Advanced Materials Engineering, Sejong University) ;
  • An, Y.B. (Department of Advanced Materials Engineering, Sejong University) ;
  • Cheon, Y.W. (Department of Advanced Materials Engineering, Sejong University) ;
  • Kim, Y.H. (Department of Advanced Materials Engineering, Sejong University) ;
  • Cho, Y.J. (Department of Advanced Materials Engineering, Sejong University) ;
  • Lee, C.M. (Department of Advanced Materials Engineering, Sejong University) ;
  • Lee, W.H. (Department of Advanced Materials Engineering, Sejong University)
  • 변창섭 (한밭대학교 공과대학 재료공학과) ;
  • 오낙현 (세종대학교 공과대학 신소재공학과) ;
  • 안영배 (세종대학교 공과대학 신소재공학과) ;
  • 천연욱 (세종대학교 공과대학 신소재공학과) ;
  • 김영훈 (세종대학교 공과대학 신소재공학과) ;
  • 조유정 (세종대학교 공과대학 신소재공학과) ;
  • 이충민 (세종대학교 공과대학 신소재공학과) ;
  • 이원희 (세종대학교 공과대학 신소재공학과)
  • Published : 2006.03.27

Abstract

Single pulse of 2.0 to 3.5 kJ from $150{\mu}F$ capacitor was applied to the cp Ti rod for its surface modification and heat treatment. Under the conditions of using 2.0 and 2.5 kJ of input energy, no phase transformation has been occurred. However, the hardness and tensile strength decreased and the elongation increased after a discharge due to a slight grain growth. By using more than 3.0 kJ of input energy, the electro discharge made a phase transformation and the hardness at the edge of the cross section increased significantly. The Ti rod before a discharge was lightly oxidized and was primarily in the form of $TiO_2$. However, the surface of the Ti rod has been instantaneously modified by a discharge into the main form of TiN from $TiO_2$. Therefore, the electro discharge can modify its surface chemistry in times as short as $200{\mu}sec$ by manipulating the input energy, capacitance, and discharging environment.

Keywords

References

  1. W. Smith, Structure and Properties of Engineering Alloys, p.437, McGRAW-HILL, New York (1993)
  2. D. Nakayama, Metal Powder Report, 43, 71 (1993)
  3. B. Berghaus, U.S.Patent 3181029 (1965)
  4. E. Rolinski, Mat. Sci. Eng., A108, 37 (1989) https://doi.org/10.1016/0921-5093(89)90404-8
  5. T. Muraleedharan and E. Meletis, Thin Solid Films, 221, 104 (1992) https://doi.org/10.1016/0040-6090(92)90802-I
  6. A. Raveh and R. Avni, Thin Solid Films, 186, 241 (1990) https://doi.org/10.1016/0040-6090(90)90146-5
  7. J. Okamoto, Jap. Soc. for Heat Treat., 40, 25 (2001)
  8. J. Okamoto, Jap. Soc. for Heat Treat., 40, 88 (2001)
  9. H. Frank and H. Lffler, Surf. Coat. Technol., 68, 729 (1994) https://doi.org/10.1016/0257-8972(94)90246-1
  10. A. Elshabini-Riad and F. Barlow, Thin Film Technology Handbook, p238, McGRAW-HILL, New York (1995)
  11. Y. Pauleau and P. Barna, Protective Coatings and Thin Films, p. 321, Nato ASI, Overijse (1989)
  12. Y. Chiba, T. Omura and H. lchinura, J. Mater. Res., 8, 1109 (1993) https://doi.org/10.1557/JMR.1993.1109