Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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The Effect of Arabic Gum on the Copper Electrodeposition using Titanium Substrate

티타늄 기지을 이용한 구리 전해도금 시 Arabic Gum 첨가제의 영향

  • Woo, Tae-Gyu (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University) ;
  • Park, Il-Song (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University) ;
  • Lee, Hyun-Woo (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University) ;
  • Seol, Kyeong-Won (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University)
  • 우태규 (전북대학교 공과대학 신소재공학부 및 공업기술연구센터) ;
  • 박일송 (전북대학교 공과대학 신소재공학부 및 공업기술연구센터) ;
  • 이현우 (전북대학교 공과대학 신소재공학부 및 공업기술연구센터) ;
  • 설경원 (전북대학교 공과대학 신소재공학부 및 공업기술연구센터)
  • Published : 2006.12.27
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Abstract

The purpose of this study is to identify the effect of additives during copper electrodeposition. Additives such as arabic gum, chloride ions and glue were used in this study. Electrochemical experiments allied to SEM and roughness examination were performed to characterize of the copper foil in the presence of additives. In the production of electrodeposited copper foil, the surface roughness and grain size of the copper foil can be controlled by addition additives. on this study, the more uniform and hemispherical copper crystals are during the initial stages, the smaller crystal size and surface roughness of copper foil are. The surface roughness of copper foil electrodeposited at the current density of 500 $mA/cm^2$ under galvanostatic mode for 60 seconds has a minimum value of 0.136 ${\mu}$m when adding 2 ppm of arabic gum.

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References

  1. C. C. Hu. C. M. We, Surface and Coatings Tech., 176, 75 (2003) https://doi.org/10.1016/S0257-8972(03)00004-5
  2. V. S. Donepudi, R. Venkatachalapathy, P. O. Ozemoyah, C. S. Johnson and J. Prakash, Electrochem. Solid-State. Lett., C13, 4 (2001)
  3. C. M. Whelan, M. R. Smyth and C. J. Barnes, J. Electroanal. Chem., 441, 109 (1998) https://doi.org/10.1016/S0022-0728(97)00415-4
  4. A. Kudelski, M. Janik-Czachorb, J. Bukowskaa, M. Dolatab and A. Szummer, J. Mol. Struct., 483, 245 (1999) https://doi.org/10.1016/S0022-2860(98)00664-4
  5. A. I. Danilov, J. E. T. Andersen, E.. B. Molodkina, Yu. M. Polukarov, P. Moller and J, Ulstrup., Electrochem. Acta, 43, 733 (1997) https://doi.org/10.1016/S0013-4686(97)00203-X
  6. N. Ikemiya, S. Miyaoko and S. Hara, Surf. Sci.,327, 261 (1995) https://doi.org/10.1016/0039-6028(94)00844-2
  7. D. R. Turner and G. R. Johnson, J. Electrochem. Soc., 109, 798 (1962) https://doi.org/10.1149/1.2425558
  8. N. L Piret, JOM April, 17 (2002) https://doi.org/10.1007/BF02701650
  9. A. J. B. Dutra and T. J. O'keefe, Copper 99-Cobre 99 International Conference, p.495, The Minerals, Metals & Materials Society, (1999)
  10. L. Bonou, M. Eyraud, R. Dcnoyel and Y. Massiani, Electrochimica Acta, 47. 4139, (2002) https://doi.org/10.1016/S0013-4686(02)00356-0
  11. P. Stante, JOM April, 19 (2002) https://doi.org/10.1007/BF02701651
  12. M. Stelter, H. Bombach and N. Nesterov, JOM April , 32 (2002) https://doi.org/10.1007/BF02701654
  13. A. J. B. Dutra and T. J. O'keefe J. Appl. Electrochem., 29. 1217 (1999) https://doi.org/10.1023/A:1003537318303