Journal of Adhesion and Interface (접착 및 계면)
- Volume 7 Issue 4
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- Pages.10-12
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- 2006
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- 1229-9243(pISSN)
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- 2233-8217(eISSN)
Lock-In Thermography Based NDT of Parts for the Automotive Industry
- Bohm, Stefan (Institute of Joining and Welding, Technical University Braunschweig) ;
- Hellmanns, Mark (Institute of Joining and Welding, Technical University Braunschweig) ;
- Backes, Andreas (Institute of Joining and Welding, Technical University Braunschweig) ;
- Dilger, Klaus (Institute of Joining and Welding, Technical University Braunschweig)
- Received : 2006.11.03
- Accepted : 2006.11.21
- Published : 2006.12.30
Abstract
The successful use of adhesively bonded parts depends on the defect-free bond of the components. Therefore it is necessary to detect relevant faults and defects in an early state of the production. A 100% test should be pursued, but especially at complicated structures the detection of defects is not easy. Possible testing methods, which show a high potential for the NDT of adhesively bonded parts, are thermography based NDT methods. At present mainly two different procedures of active thermography are being used: Pulse and Lock-In Thermography. With pulse thermography the examined material is warmed up with a short energy pulse (light, eddy current or ultrasonic pulse) and the heat response is recorded after a certain time. The result is an infrared image which indicates material defects in different depths. This paper presents a variety of images showing the capability of Lock-In Thermography to image subsurface defects. Several examples of adhesives joints qualify the ultrasonic Lock-In-Thermography for the in-process quality control for adhesive bonded components.