Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
권호 표지

Development and Applications of Material Testers for the Thin Films

박막 재료 시험기 개발 및 응용

  • 안현균 (한국기계연구원 나노공정장비연구센터) ;
  • 이학주 (한국기계연구원 나노공정장비연구센터) ;
  • 오충석 (금오공과대학교 기계공학부)
  • Published : 2006.03.01
Download PDF
⟨ Previous Next ⟩

Abstract

Thin films play an important role in many technological applications including microelectronic devices, magnetic storage media, MEMS and surface coatings. It is well known that a thin film's material properties can be very different front the corresponding bulk properties and thus there has been a strong need for the development of a miniature tester to measure the mechanical properties of a thin film. Two testers are designed and set up in small size of 62 mm width, 20 mm depth and 90-120 mm height to fit in a chamber of scanning electron microscope (SEM). One tester has a homemade 0.2 N load cell and a low-priced electromagnetic actuator. The other has a commercial 5 N load cell, a $52{\mu}m$ piezoelectric actuator and some novel grips. Two types of 3.5 microns thick polysilicon specimen are tested to prove the testers' applicability. The strain is measured by the two ways. Firstly, it is measured by an ISDG system in the atmosphere far the reference. Secondly, the same test is repeated in a SEM chamber to monitor the strain as an in-situ experiment. The strain is evaluated by observing the gap change between two markers.

Keywords

References

  1. Freund, L. B., Suresh S., 'Thin Film Materials,' Cambridge, 2003
  2. Norton, R. L., 'Machine Design, Prentice Hall,' Ch. 2, 2000
  3. Read, D. T., Dally, J. W., 'A New Method for Measuring the Strength and Ductility of Thin Films,' J. Mater. Res., Vol. 8, pp. 1542-1549, 1993 https://doi.org/10.1557/JMR.1993.1542
  4. Oh, C.-S., Sharpe, W. N. Jr., 'Techniques for Measuring Mechanical Properties of Poly silicon using an ISDG,' J. of the KSPE, Vol. 27, No.7, pp. 171-178, 2004
  5. Kim, D. I., Huh, Y H., Kee, C. D., 'Measurement of Tensile Properties of Copper Foil using Micro-ESPI Technique,' J. of the KSPE, Vol. 21, No.8, pp. 89-96, 2004
  6. Tsuchiya, T., Shikida, M., Sato, K., 'Tensile Testing System for Sub-micrometer Think Films,' Sensors & Actuators A, Vol. 97-98, pp. 492-496, 2002 https://doi.org/10.1016/S0924-4247(01)00862-7
  7. Chasiotis, I., Knauss, W G., 'A New Microtensile Tester for the Study of MEMS Materials with the Aid of Atomic Froce Microscopy,' Exp. Mech., Vol. 42, pp. 51-57, 2002 https://doi.org/10.1007/BF02411051
  8. Haque, M. A., Saif, M. T. A., 'Application of MEMS Force Sensors for in situ Mechanical Characterization of Nano-scale Thin Films in SEM and TEM,' Sensors & Actuators A, Vol. 97-98, pp. 239-245, 2002 https://doi.org/10.1016/S0924-4247(01)00861-5
  9. Haque, M. A., Saif, M. T. A., 'In-situ Tensile Testing of Nano-scale Specimens in SEM and TEM,' Exp. Mech., Vol. 42, pp. 123-128, 2002 https://doi.org/10.1007/BF02411059
  10. Isono, Y, Kiuchi, M., Sugiyama, S., Morita, T., Matsui, S., 'Mechanical Characteristic of FIB Deposited Carbon Nanowire by Electrostatic Actuated Nano Tensile Testing Device (EANAT),' 18th Int. Conf. on MEMS, 2005 https://doi.org/10.1109/MEMSYS.2005.1454071
  11. CATIA, V5R10, Dassault Systemes
  12. http://www.wazau.com/en/sensors/druck_zug.html
  13. http://www.cedrat.com/
  14. Kim, S.-W., Oh, C.-S., Lee, H.-J., 'Effects of Specimen Alignment on the Mechanical Properties of Polysilicon Film,' MRS Symposium O81, 2005
  15. Koester, D., Cowen, A., Mahadevan, R., Stonefield, M., Hardy, B., 'Poly MUMPs Design Handbook,' Rev. 10.0, MEMScAP, 2003
  16. Sharpe, W. N. Jr., 'An Interferometric Strain/Displacement Measurement System,' NASA Technical Memorandum 101638, 1989
  17. Sharpe, W.N. Jr., 'Mechanical Properties of MEMS Materials,' The MEMS Handbook, CRC Press, pp. 3-1 to 3-33, 2001
  18. Oh, C.-S., Lee, H.-J., Ko, S.-G., Kim, S.-W, Ahn, H.-G., 'Comparison of the Young's Modulus of Polysilicon Film by Tensile Testing and Nanoindentation,' Sensors & Actuators A, Vol. 117, pp. 151-159, 2005 https://doi.org/10.1016/j.sna.2004.06.008