Journal of the Korean Ceramic Society (한국세라믹학회지)

The Korean Ceramic Society (한국세라믹학회)
권호 표지
DOI QR코드

DOI QR Code

Lamination of LTCC Sheet Using Binder Film

Binder Film을 이용한 LTCC Sheet 적층

  • Shin, Hyo-Soon (System Module Group, Korea Institute Ceramic Engineering and Technology) ;
  • Choi, Yong-Seok (Central R&B Institute, Samsung Electro-Mechanics) ;
  • Park, Eun-Tae (Central R&B Institute, Samsung Electro-Mechanics)
  • 신효순 (요업기술원 시스템모듈사업단) ;
  • 최용석 (삼성전기주식회사 중앙연구소) ;
  • 박은태 (삼성전기주식회사 중앙연구소)
  • Published : 2006.04.01
Download PDF
⟨ Previous Next ⟩

Abstract

In the lamination process of multi-layer ceramic modules, the occurrence of delamination comes into repeatedly. To completely improve the lamination process of LTCC sheets, a binder film was introduced between the layers. The binder film did not originate the delamination until the thickness under $40{\mu}m$. After lamination, the thickness of the binder film was determined by the infilteraion of binder by the pressure, and after the bake-out, was dependent on the decomposition of binder resin. Any detectable defect was not observed in the multilayer structure with Ag inner electrodes.

Keywords

References

  1. S. W. Lee, K. H. Kim, K. B. Shim, and K. D. Koo, 'Fabrication of Low Temperature Cofired Ceramic (LTCC) Chip Couplers for High Frequencies: II. Effect of Sintering Process on Ag Diffusion(in Korean),' J. Kor. Ceram. Soc., 36 [5] 490-96 (1999)
  2. J. H. Park and J. G. Park, 'Summary of LTCC Material and Process,' Ceramist, 4 [4] 41-8 (2001)
  3. K. B. Shim, N. T. Cho, and S. W. Lee, 'Silver Diffusion and Microstructure in LTCC Multilayer Couplers for High-Frequency Applications,' J. Mater. Sci., 35 813-20 (2000) https://doi.org/10.1023/A:1004769501698
  4. M. Udovic, M. Valant, and D. Duvorov, 'Phase-Formation and Dielectric Characterization of the $Bi_2O_3-TeO_2$ System Prepared in an Oxygen Atmosphere,' J. Am. Ceram. Soc., 87 [4] 591-97 (2004) https://doi.org/10.1111/j.1551-2916.2004.00591.x
  5. F. Huang and D. L. Wilcox Sr., 'Use of Titanates to Achieve a Temperature-Stable Low-Temperature Cofired Ceramic Dielectric for Wireless Applications,' J. Am. Ceram. Soc., 85 [4] 828-32 (2002) https://doi.org/10.1111/j.1151-2916.2002.tb00179.x
  6. H. Jantunen, A. Uusimaki, R. Rautioaho, and S. Leppavuori, 'Temperature-Coefficient of Microwave Resonance Frequency of a Low-Temperature Cofired Ceramic (LTCC) System,' J. Am. Ceram. Soc., 85 [3] 697-99 (2002)
  7. B. K. Kim, 'Future of LTCC,' Ceramist, 6 [1] 5-12 (2003)
  8. US patent US 6,776,861
  9. US patent US 6,949,156
  10. M. A. Piwonski and A. Roosen, 'Low Pressure Lamination of Ceramic Green Tapes by Gluing at Room Temperature,' J. Eur. Ceram. Soc., 19 [2] 263-70 (1999) https://doi.org/10.1016/S0955-2219(98)00196-4
  11. A. Roosen, 'New Lamination Technique to Join Ceramic Green Tapes for the Manufacturing of Multilayer Devices,' J. Eur. Ceram. Soc., 21 [10-11] 1993-96 (2001) https://doi.org/10.1016/S0955-2219(01)00158-3