The Transactions of The Korean Institute of Electrical Engineers (전기학회논문지)

The Korean Institute of Electrical Engineers (대한전기학회)
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Fabrication of Hollow-type Silicon Microneedle Array Using Microfabrication Technology

반도체 미세공정 기술을 이용한 Hollow형 실리콘 미세바늘 어레이의 제작

  • 김승국 (고려대 공대 전기공학과) ;
  • 장종현 (고려대 공대 전기공학과) ;
  • 김병민 (고려대 공대 전기공학과) ;
  • 양상식 (아주대 전자공학과) ;
  • 황인식 (케이엠에이치(주) 중앙연구소) ;
  • 박정호 (고려대 공대 전기공학과)
  • Published : 2007.12.01
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Abstract

Hollow-type microneedle array can be used for painless, continuous and stable drug delivery through a human skin. The needles must be sharp and have sufficient length in order to penetrate the epidermis. An array of hollow-type silicon microneedles was fabricated by using deep reactive ion etching and HNA wet etching with two oxide masks. Isotropic etching was used to create tapered tips of the needles, and anisotropic etching of Bosch process was used to make the extended length and holes of microneedles. The microneedles were formed by three steps of isotropic, anisotropic, and isotropic etching in order. The holes were made by one anisotropic etching step. The fabricated microneedles have $170{\mu}m$ width, $40{\mu}m$ hole diameter and $230{\mu}m$ length.

Keywords

References

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