Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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Liquid Cooling System Using Planar ECF Pump for Electronic Devices

평면형 ECF 펌프를 이용한 전자기기 액체냉각 시스템

  • 서우석 (한국기계연구원 나노기계연구본부) ;
  • 함영복 (한국기계연구원 나노기계연구본부) ;
  • 박중호 (한국기계연구원 나노기계연구본부) ;
  • 윤소남 (한국기계연구원 나노기계연구본부) ;
  • 양순용 (울산대학교 기계자동차공학부)
  • Published : 2007.12.01
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Abstract

This paper presents a liquid cooling concept for heat rejection of high power electronic devices existing in notebook computers etc. The design, fabrication, and performance of the planar ECF pump and farced-liquid cooling system are summarized. The electro-conjugate fluid (ECF) is a kind of dielectric and functional fluids, which generates jet flows (ECF-jets) by applying static electric field through a pair of rod-like electrodes. The ECF-jet directly acts on the working fluid, so the proposed planar ECF pump needs no moving part, produces no vibration and noise. The planar ECF pump, consists of a pump housing and electrode substrate, achieves maximum flow rate and output pressure of $5.5\;cm^3/s$ and 7.2 kPa, respectively, at an applied voltage of 2.0 kV. The farced-liquid cooling system, constructed with the planar ECF pump, liquid-cooled heat sink and thermal test chip, removes input power up to 80 W keeping the chip surface temperature below $70\;^{\circ}C$. The experimental results demonstrate that the feasibility of forced-liquid cooling system using ECF is confirmed as an advanced cooling solution on the next-generation high power electronic devices.

Keywords

References

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