The study on cure behavior and dielectric property of Ceramic (BNT)-Polymer (BCB) composite material

세라믹(BNT)-폴리머(BCB) 복합체의 경화 거동과 유전특성에 대한 연구

  • Kim, Un-Yong (Advanced Materials and Components Lab., Korea Institute of Ceramic Engineering and Technology) ;
  • Chun, Myoung-Pyo (Advanced Materials and Components Lab., Korea Institute of Ceramic Engineering and Technology) ;
  • Cho, Jung-Ho (Advanced Materials and Components Lab., Korea Institute of Ceramic Engineering and Technology) ;
  • Kim, Byung-Ik (Advanced Materials and Components Lab., Korea Institute of Ceramic Engineering and Technology) ;
  • Myoung, Sung-Jae (Advanced Materials and Components Lab., Korea Institute of Ceramic Engineering and Technology) ;
  • Sin, Dong-Uk (Department Materials Science Engineering, Hanyang University)
  • 김운용 (요업기술원 첨단소재부품팀) ;
  • 전명표 (요업기술원 첨단소재부품팀) ;
  • 조정호 (요업기술원 첨단소재부품팀) ;
  • 김병익 (요업기술원 첨단소재부품팀) ;
  • 명성재 (요업기술원 첨단소재부품팀) ;
  • 신동욱 (한양대학교 신소재공학부)
  • Published : 2007.12.31

Abstract

We made $(1-x)BCB-xBNT(BaNd_2Ti_4O_{12})$ (x=20, 30, 40, 50 vol%) composite thick film with a high dielectric constant and low loss by the hand casting method. Dielectric constant and dielectric loss of prepared thick film are measured at 1MHz and curing behavior of the film are observed through thermal analysis such as DSC. We investigated the effect of contents of BNT filler and curing behavior of film on dielectric properties of BCB-BNT composite. Dielectric constant increased with increasing BNT filler from 20 to 50 vol% and dielectric loss ($tan{\delta}$) decreased with increasing BNT filler. Dielectric constant and loss ($tan{\delta}$) of composite material was not nearly dependent on the curing behavior. But as a result of TCC (Temperature Characteristics of Coefficient) decreased with increasing the curing temperature, we confirmed that the curing of these composite system is most stable above $250^{\circ}C$.

높은 유전상수와 낮은 유전손실을 가지는 $(1-x)BCB-xBNT(BaNd_2Ti_4O_{12})$ (x=20, 30, 40, 50 vol%) 복합 재료를 제작하였다. 제작된 film의 유전 상수와 유전 손실은 1 MHz에서 측정되었고, DSC와 같은 열분석을 통하여 그 경화거동을 관찰하고, BNT의 함량과 film의 경화 거동이 유전특성에 어떠한 영향을 미치는지에 대하여 조사하였다. 충진제로 사용된 BNT가 $20{\sim}50vol%$까지 증가함에 따라 그 복합체의 유전상수는 증가, 유전 손실($tan{\delta}$)은 감소하였고, BCB-BNT 복합체의 유전 상수와 유전 손실($tan{\delta}$)은 경화 반응에 거의 영향을 받지 않는다. 그러나 경화 온도가 증가함에 따라 TCC(Temperature Characteristics of Coefficient)가 감소하는 것으로 복합체의 경화는 $250^{\circ}C$ 이상에서 가장 안정하다는 것을 확인하였다.

Keywords

References

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