Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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Effect of Pulse and Pulse-Reverse Current on Surface Morphology and Resistivity of Electrodeposited Copper

정펄스 및 역펄스 방법을 이용하여 구리 전해도금 시 전착층의 표면 형상과 고유저항에 미치는 효과

  • Woo, Tae-Gyu (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University) ;
  • Park, Il-Song (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University) ;
  • Seol, Kyeong-Won (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University)
  • 우태균 (전북대학교 공과대학 신소재공학부 및 공업기술연구센터) ;
  • 박일송 (전북대학교 공과대학 신소재공학부 및 공업기술연구센터) ;
  • 설경원 (전북대학교 공과대학 신소재공학부 및 공업기술연구센터)
  • Published : 2007.01.27
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Abstract

Recently, requirement for the ultra thin copper foil increases with smaller and miniaturized electronic components. In this study, we evaluated the surface morphology, crystal phase ana surface roughness of the copper film electrodeposited by pulse method without using additives. Homogeneous and dense copper crystals were formed on the titanium substrate, and the optimum condition was 25% duty cycle. Moreover, the surface roughness(Ra), $0.295{\mu}m$, is the smallest value in this condition. It is thought that this copper foil is good for electromigration inhibition due to the preferential crystal growth of Cu (111)

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References

  1. Y. K. Lee and T. J. O'keefe, JOM, April, 40 (2002)
  2. C. C. Hu and C. M. Wu, Surf. Coat. Technol., 176, 75 (2003) https://doi.org/10.1016/S0257-8972(03)00004-5
  3. V. S. Donepudi, R. Venkatachalapathy, P. O. Ozernoyah, C.S. Johnson and J. Prakash, Electrochem. Solid-State. Lett., C13, 4 (2001) https://doi.org/10.1149/1.1342144
  4. C. M. Whelan, M. R. Smyth and C. J. Barnes, J. Electroanal. Chem., 441, 109 (1998) https://doi.org/10.1016/S0022-0728(97)00415-4
  5. A. Kudelski, M. Janik-Czachor, J. Bukowska, M. Dolata and A. Szurnrner, J. Mol. Struct., 483, 245 (1999) https://doi.org/10.1016/S0022-2860(98)00664-4
  6. A. I. Danilov, J. E. T. Andersen, E. B. Molodkina, Yu. M. Polukarov, P. Moller and J. Ulstrup., Electrochim. Acta, 43, 733 (1997) https://doi.org/10.1016/S0013-4686(97)00203-X
  7. N. Ikemiya, S. Miyaoko and S. Hara, Surf. Sci., 327, 261 (1995) https://doi.org/10.1016/0039-6028(94)00844-2
  8. S. C. Chang, J. M. Shieh, K. C. Lin, B. T. Dai, T. C. Wang, C. F. Chen and M. S. Feng, J. Vac. Sci. Technol., B, 19(3), 767 (2001) https://doi.org/10.1116/1.1368673
  9. D. S. Lashmore, L. H Bennett, H. E. Schone, P. Gustafson and R.E. Watson, Phys Rev. Lett., 48, 1760 (1982) https://doi.org/10.1103/PhysRevLett.48.1760
  10. N. Ibl, J. Cl. Puippe and H. F. Angerer, Surf. Technol., 6, 287 (1978) https://doi.org/10.1016/0376-4583(78)90044-4
  11. B. S. Min, W. S. Chung and I. G. Kim, J. Kor. Inst. Met. & Mater., 40, 1281 (2002)
  12. W. Paatsch, Metallobrflache, 41, 39 (1987)
  13. E. Budevski, G. Staikov and W. J. Lorenz, Electrochemical Phase Formation and Growth, VCH, 273 (1996)
  14. O. Chene, G. Staikov and D. Landolt, Oberflache/Surface, 26, 45 (1985)
  15. H. S. Lee, H. S. Kim and C. M. Lee, J. Kor. Inst. Met. & Mater., 39, 920 (2001)
  16. R. T. C. Choo, J. M. Toguri, M. El-sherik and U. Erb, J. Appl. Electrochem., 25, 384 (1994)

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