DOI QR코드

DOI QR Code

Study on the Compositions of Photosensitive Ag Paste for Patterning Embedded Fine-Line Inductor in LTCC

LTCC 내장형 미세 라인 인덕터 구현을 위한 감광성 Ag Paste 조성에 관한 연구

  • Lee, Sang-Myoung (Electronic Materials Packaging Research Center, Korea Electronics Technology Institute) ;
  • Park, Seong-Dae (Electronic Materials Packaging Research Center, Korea Electronics Technology Institute) ;
  • Yoo, Myong-Jae (Electronic Materials Packaging Research Center, Korea Electronics Technology Institute) ;
  • Lee, Woo-Sung (Electronic Materials Packaging Research Center, Korea Electronics Technology Institute) ;
  • Kang, Nam-Kee (Electronic Materials Packaging Research Center, Korea Electronics Technology Institute) ;
  • Nahm, Sahn (Department of Materials Science and Engineering, Korea University)
  • 이상명 (전자부품연구원 전자소재패키징연구센터) ;
  • 박성대 (전자부품연구원 전자소재패키징연구센터) ;
  • 유명재 (전자부품연구원 전자소재패키징연구센터) ;
  • 이우성 (전자부품연구원 전자소재패키징연구센터) ;
  • 강남기 (전자부품연구원 전자소재패키징연구센터) ;
  • 남산 (고려대학교 신소재공학과)
  • Published : 2007.03.31

Abstract

Line width under $100\;{\mu}m$ with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of $30\;{\mu}m$ with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

Keywords

References

  1. D. Amey and P. Barnwell, 'Ceramic Technology for Integrated Packaging for Wireless,' IEEE Integrated Circuits Symposium, 63-6 (1999) https://doi.org/10.1109/RFIC.1999.805240
  2. S. D. Park, H. G.. Kang, Y. H. Park, and J. D. Mun, 'LTCC and LTCC-M Technologies for Multichip Module,' J. Microelectronic & Packaging Soc., 6 [3] 25-35 (1999)
  3. S. D. Park, M. J. Yoo, N. K. Kang, and J. C. Park, 'Fabrication of Photoimageable Silver Paste for Low-Temperature Cofiring Using Acrylic Binder Polymers and Photosensitive Materials,' Macromolecular Research, 12 [4] 391-98 (2004) https://doi.org/10.1007/BF03218417
  4. C. R. Chang and J. H. Jean, 'Effects of Silver-Paste Formulation on Camber Development during the Cofiring of a Silver-Based, Low-Temperature-Cofired Ceramic Package,' J. Am. Ceram. Soc., 81 [11] 2805-14 (1998) https://doi.org/10.1111/j.1151-2916.1998.tb02700.x
  5. M. Skurski, M. Smith, R. Draudt, D. Amey, S. Horowitz, and M. Champ, 'Photoimageable Silver Cofireable Conductor Compatible with 951 Green Tape,' Int. J. Microcircuits and Electronic Packaging, 21 [4] 355-60 (1998)
  6. Y. L. Wang, P. J. Ollivier, and M. A. Skurski, 'Photoformed Thick Film Materials and their Application to Fine Feature Circuitry,' pp. 579-584, Proceedings of 2000 International Conference on High-Density Interconnect and Systems Packaging, Denver, Colorado, 2000
  7. T. Masaki, A. Yoshimura, K. Iwanaga, and G. Tanaka, 'Photosensitive Conductive Paste,' pp. 356-361, Proceedings of 97 IEMT/IMC, 1997
  8. S. D. Park, N. M. Kang, J. K. Lim, D. K. Kim, N. K. Kang, and J. C. Park, 'Photolithographic Properties of Photosensitive Ag Paste for Low Temperature Cofiring(in Korean),' J. Kor. Ceram. Soc., 41 [4] 313-22 (2004) https://doi.org/10.4191/KCERS.2004.41.4.313
  9. R. M. German, 'Sinterring Galss-Filled Ceramic Composite : Effect of Glass Properties,' Ceramic Transaction, 1 969-77 (1998)
  10. S. W. Lee, K. H. Kim, K. B. Shimb, and K. D. Koo, 'Fabrication of Low Temperature Cofired Ceramic (LTCC) Chip Couplers for High Frequencies : Effect of Sintering Process on Ag Diffusion(in Korean),' J. Kor. Ceram. Soc., 36 [5] 490-96 (1999)
  11. B. B. Koo and H. G. Kim, 'Effect of Frit and Sintering Conditions on the Microstructure and Electrical Property in Ag and Ag/Pd Thick Film Conductors(in Korean),' J. Kor. Ceram. Soc., 25 [6] 623-30 (1988)