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낮은 저항온도계수를 갖는 박막 저항체 제작 및 신뢰성 특성 평가

Fabrication and Reliability Properties of Thin film Resistors with Low Temperature Coefficient of Resistance

  • 이붕주 (인하대학교 전기공학과 기능성박막연구실)
  • 발행 : 2007.04.01

초록

The Ni/Cr/Al/Cu (51/41/4/4 wt%) thin films were deposited by using DC magnetron sputtering method for the application of the resistors having low TCR (temperature coefficients of resistance) and high resistivity from the former printed-results[3]. The TCR values measured on the as-deposited thin film resistors were less than ${\pm}10\;ppm/^{\circ}C$ and $-6{\sim}+1\;ppm/^{\circ}C$ after annealing and packaging process. The TCR values were $-3{\sim}1\;ppm/^{\circ}C$ (ratio of variation : about 0.02 %) and $-30{\sim}20\;ppm/^{\circ}C$ (ratio of variation : about $0.5{\sim}1\;%$) for the thermal cycling and PCT (pressure cooker test), respectively. It was confirmed that the reliability properties of the thin film resistor were good for electronic components.

키워드

참고문헌

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