Journal of Welding and Joining

  • 제25권3호
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  • Pages.57-63
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  • 2007
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
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NaBr 및 NaF 용액에 대한 Sn-3.0Ag-0.5Cu 솔더 합금의 Electrochemical Migration 특성

Electrochemical Migration Characteristics of Sn-3.0Ag-0.5Cu Solder Alloy in NaBr and NaF Solutions

  • 정자영 (안동대학교 신소재공학부) ;
  • 장은정 (안동대학교 신소재공학부) ;
  • 유영란 (안동대학교 신소재공학부) ;
  • 이신복 (서울대학교 재료공학부) ;
  • 김영식 (안동대학교 신소재공학부) ;
  • 주영창 (서울대학교 재료공학부) ;
  • 정태주 (안동대학교 신소재공학부) ;
  • 이규환 (한국기계연구원 표면기술연구센터) ;
  • 박영배 (안동대학교 신소재공학부)
  • Jung, Ja-Young (School of Materials Science and Engineering, Andong National University) ;
  • Jang, Eun-Jung (School of Materials Science and Engineering, Andong National University) ;
  • Yoo, Young-Ran (School of Materials Science and Engineering, Andong National University) ;
  • Lee, Shin-Bok (School of Materials Science and Engineering, Seoul National University) ;
  • Kim, Young-Sik (School of Materials Science and Engineering, Andong National University) ;
  • Joo, Young-Chang (School of Materials Science and Engineering, Seoul National University) ;
  • Chung, Tai-Joo (School of Materials Science and Engineering, Andong National University) ;
  • Lee, Kyu-Hwan (Surface Technology Research Center, Korea Institute of Machinery and Materials) ;
  • Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
  • 발행 : 2007.06.30
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초록

Electrochemical migration characteristics of Pb-free solder alloys are quantitatively correlated with corrosion characteristics in harsh environment conditions. In-situ water drop test and corrosion resistance test for Sn-3.0Ag-0.5Cu solder alloys were carried out in NaBr and NaF solutions to obtain the electrochemical migration lifetime and pitting potential, respectively. Sn-3.0Ag-0.5Cu solder alloy shows similar ionization and electrochemical migration behavior with pure Sn because of Ag and Cu do not migrate due to the formation of resistant intermetallic compounds inside solder itself. Electrochemical migration lifetime in NaBr is longer than in NaF, which seems to be closely related to higher pitting potential in NaBr than NaF solution. Therefore, it was revealed that electrochemical migration lifetime of Sn-3.0Ag-0.5Cu solder alloys showed good correlation to the corrosion resistance, and also the initial ionization step at anode side is believed to be the rate-determining step during electrochemical migration of Pb-free solders in these environments.

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참고문헌

  1. D. Q. Yu, W. Jillek, E. Schmitt, : Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water, J Mater Sci, : Mater Electron, 17 (2006), 219-227 https://doi.org/10.1007/s10854-006-6764-0
  2. C.A. Tseng, J.C. Lin, Y.F. Hong, H.W. Chien: Influence of cooling rate of the reflowed Sn-9Zn-(0-4)Ag solder on the electrochemical migration, 14th Asian-Pacific Corrosion control Conference, (2006)
  3. Udit S. Mohanty, K. L. Lin : Effect of Al on the electrochemical corrosion behavior of Pb free Sn-8.5Zn-0.5Ag-XAl-0.5Ga solder in 3.5% NaCl solution, Applied Surface Science., 252 (2006), 5907-5916 https://doi.org/10.1016/j.apsusc.2005.08.020
  4. Udit Surya Mohanty, Kwang-Lung Lin: Electrochemical corrosion behavior of lead-free Sn-8.5Zn-XAg-0.1Al-0.5Ga solder in 3.5% NaCl solution, Material Science and Engineering A, 406 (2005), 34-42 https://doi.org/10.1016/j.msea.2005.05.101
  5. Fei-Yi Hung, Hung-Mao Lin, Puo-Sheng Chen, Truan- Sheng Lui, Li-Hui Chen : A study of the thin film on the surface of Sn-3.5Ag/Sn-3.5Ag-2.0Cu lead free alloy, Journal of Alloys and Compounds, 415 (2006), 85-92 https://doi.org/10.1016/j.jallcom.2005.07.050
  6. T. Takemoto, R. M. Latanisioni, T. W. Eagart, A. Matsunawa: Electrochemical Migration Test of Solder alloys in Pure Water, Corrosion Science, 39-8 (1997), 1415-1430 https://doi.org/10.1016/S0010-938X(97)00038-3
  7. Hirokazu Tanaka, ESPEC TECHNOLOGY REPORT, No. 14
  8. B. Rudra, D. Jennings: Failure-Mechanism Models for Conductive-Filament Formation, IEEE Transactions on reliability, 43-3 (1994), 354-360 https://doi.org/10.1109/24.326425
  9. J. Y. Jung, S. B. Lee, Y. R. Yoo, Y. S. Kim, Y. C. Joo and Y. B. Park : Dominant migration Element in Electrochemical migration of Eutectic SnPb solder Alloy in D.I Water and NaCl solution, Journal of the Microelectronics & Packaging Society, 13-3 (2006), 1-8 (in Korean)
  10. J. Y. Jung, Y. R. Yoo, S. B. Lee, Y. S. Kim, Y. C. Joo and Y. B. Park : Effect of $SO_4^{2-}$ Ion on Corrosion and Electrochemical migration of Eutectic SnPb solder alloy, Korean journal of Material Research, 17-1 (2007), 43-49 (in Korean) https://doi.org/10.3740/MRSK.2007.17.1.043
  11. J. Y. Jung, S. B. Lee, E. J. Jang, Y. R. Yoo, Y. S. Kim, Y. C. Joo and Y. B. Park: Correlation between Corrosion Resistance and Electrochemical migration Lifetimes of solder alloys in Cl- and $SO_4^{2-}$ ion environment, the 14th Korean Conference on Semiconductors (2007) (in Korean)
  12. Masato Mori, Kazuma Miura, Takeshi Sasaki, Toshiaki Ohtsuka: Corrosion of tin alloys in sulfuric and nitric acids, Corrosion Science, 44 (2002) 887-898 https://doi.org/10.1016/S0010-938X(01)00094-4
  13. F. J. Grunthaner, T. W. Griswold, P. J. Clendening, Migratory gold resistive shorts: Chemical aspects of a failure mechanism, california Institute of technology Jet Propulsion lab., 91103
  14. Denny A. Jones: Principles and Prevention of Corrosion (9th Edition), Macmillan Publishing Co., 1987