Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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Effect of Kind and Thickness of Seed Metal on the Surface Morphology of Copper Foil

Seed 금속의 종류와 두께에 따른 구리 전착층의 표면형상에 미치는 영향

  • Woo, Tae-Gyu (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University) ;
  • Park, Il-Song (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University) ;
  • Seol, Kyeong-Won (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University)
  • 우태규 (전북대학교 공과대학 신소재공학부 및 공업기술연구센터) ;
  • 박일송 (전북대학교 공과대학 신소재공학부 및 공업기술연구센터) ;
  • 설경원 (전북대학교 공과대학 신소재공학부 및 공업기술연구센터)
  • Published : 2007.05.27
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Abstract

This study aimed to investigate the effects of the seed layer with copper electroplating on the surface morphology of copper foil. Three kinds of seed metal such as platinum, palladium, Pt-Pd alloy were used in this study. Electrodeposition was carried out with the constant current density of 200 $mA/cm^2$ for 68 seconds. Electrochemical experiments, in conjunction with SEM, XRD, AFM and four-point probe, were performed to characterize the morphology and mechanical characteristics of copper foil. Large particles were observed on the surface of the copper deposition layer when a copper foil was electroplated on the 130 nm thickness of Pd, Pt-Pd seed layer. However, a homogeneous surface, low resistivity was obtained when the 260 nm thickness of Pt, Pt-Pd alloy seed layer was used. The minimum value of resistivity was 2.216 ${\mu}{\Omega}-cm$ at the 260 nm thickness of Pt-Pd seed layer.

Keywords

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