Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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Activation Energy and Interface Reaction of Sn-40Pb/Cu & Sn-3.0Ag-0.5Cu/Cu

Sn-40Pb/Cu 및 Sn-3.0Ag-0.5Cu/Cu 접합부 계면반응 및 활성화에너지

  • Kim, Whee-Sung (Department of Materials Engineering, Korea Aerospace University) ;
  • Hong, Won-Sik (Reliability and Failure Analysis Center, Korea Electronics Technology Institute) ;
  • Park, Sung-Hun (Department of Materials Engineering, Korea Aerospace University) ;
  • Kim, Kwang-Bae (Department of Materials Engineering, Korea Aerospace University)
  • 김휘성 (한국항공대학교 항공재료공학과) ;
  • 홍원식 (전자부품연구원 신뢰성평가센터) ;
  • 박성훈 (한국항공대학교 항공재료공학과) ;
  • 김광배 (한국항공대학교 항공재료공학과)
  • Published : 2007.08.27
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Abstract

In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.

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References

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