The Transactions of The Korean Institute of Electrical Engineers (전기학회논문지)

The Korean Institute of Electrical Engineers (대한전기학회)
권호 표지

The Destruction Effects of Semiconductors by High Power Electromagnetic Wave

고출력 과도전자파에 의한 반도체 소자의 파괴효과

  • Published : 2007.09.01
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Abstract

This paper investigated the destruction effect of the semiconductors by impact of high power electromagnetic wave. The experiments is employed as an open-ended waveguide to study the destruction effects on semiconductor using a 2.45 GHz 600 W Magnetron as a high power electromagnetic wave. The semiconductors are located at a distance of $31cm\sim40cm$ from the open-ended waveguide and are composed of a LED drive circuit for visual discernment. Also the chip condition of semiconductor is observed by SEM(Scanning Electron Microscope) analysis. The semiconductor are damaged by high power electromagnetic wave at about 860 V/m. The SEM analysis of the destructed devices showed onchipwire and bondwire destructions. Based on the result, semiconductor devices should have plan to protect the semiconductor devices form high power electromagnetic wave. And the database from this experiment provides the basis for future investigation.

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References

  1. D. Taylor, D. V. Giri, 'High-power microwave systems and effects', Washington, D. C., Taylor & Francis, 1994
  2. M. Camp, H. Garbe, H. Gerth, 'Predicting the Breakdown Behavior of Microcontrollers Under EMP/UWB Impact Using a Statistical Analysis' IEEE Trans. on Electromagnetic Compatibility Vol. 46, p. 369, 2004
  3. M. Camp, H. Garbe, D. Nitsch, 'Influence of the technology on the destruction effects of semiconducters by impact of EMP and UWB pulses', IEEE Trans. on EMC Vol. 1, pp. 87-92, 2002
  4. D. Nitsch, M. Camp, F. Sabath, J. L. Haseborg, H. Garbe, 'Susceptibility of some electronic equipment to HPEM threats', IEEE Trans. on EMC, Vol. 46, No. 3, pp.380-389, 2004
  5. S. Korte, M. Camp, H. Garbe, 'Hardware and software simulation of transient pulse impact on integrated circuits', IEEE EMC 2005 Intemational Symposium, Vol. 2, pp. 489-494, 2005
  6. A. Mertol 'Estimation of aluminum and gold bond wire fusing current and fusing time' Components, Packaging and manufacturing technology Vol. 18 NO. 1 pp. 210-214, 1995 https://doi.org/10.1109/96.365510