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Microstructure and Electrical Resistivity of Ink-Jet Printed Nanoparticle Silver Films under Isothermal Annealing

잉크젯 프린팅된 은(Ag) 박막의 등온 열처리에 따른 미세조직과 전기 비저항 특성 평가

  • Choi, Soo-Hong (Department of Materials Science and Engineering, Seoul National University) ;
  • Jung, Jung-Kyu (Department of Materials Science and Engineering, Seoul National University) ;
  • Kim, In-Young (Central R&D Institute, Samsung Electro-Mechanics) ;
  • Jung, Hyun-Chul (Central R&D Institute, Samsung Electro-Mechanics) ;
  • Joung, Jae-Woo (Central R&D Institute, Samsung Electro-Mechanics) ;
  • Joo, Young-Chang (Department of Materials Science and Engineering, Seoul National University)
  • Published : 2007.09.27

Abstract

Interest in use of ink-jet printing for pattern-on-demand fabrication of metal interconnects without complicated and wasteful etching process has been on rapid increase. However, ink-jet printing is a wet process and needs an additional thermal treatment such as an annealing process. Since a metal ink is a suspension containing metal nanoparticles and organic capping molecules to prevent aggregation of them, the microstructure of an ink-jet printed metal interconnect 'as dried' can be characterized as a stack of loosely packed nanoparticles. Therefore, during being treated thermally, an inkjet-printed interconnect is likely to evolve a characteristic microstructure, different from that of the conventionally vacuum-deposited metal films. Microstructure characteristics can significantly affect the corresponding electrical and mechanical properties. The characteristics of change in microstructure and electrical resistivity of inkjet-printed silver (Ag) films when annealed isothermally at a temperature between 170 and $240^{\circ}C$ were analyzed. The change in electrical resistivity was described using the first-order exponential decay kinetics. The corresponding activation energy of 0.44 eV was explained in terms of a thermally-activated mechanism, i.e., migration of point defects such as vacancy-oxygen pairs, rather than microstructure evolution such as grain growth or change in porosity.

Keywords

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