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A Study on the Plate-Type Polymer Hyperfine Pit Structure Fabrication and Mechanical Properties Measurement by Using Thermal-Nanoindentation Process

열간나노압입공정을 이용한 극미세 점구조체 제작을 위한 플라스틱소재 판의 기계적 특성 조사

  • 이은경 (부산대학교 하이브리드소재솔류션협동과정) ;
  • 강충길 (부산대학교 정밀정형 및 금형가공연구소)
  • Published : 2008.12.01

Abstract

It's important to measure quantitative properties about thermal-nano behavior of polymer for producing high quality components using Nanoimprint lithography process. Nanoscale indents can be used to make the cells for molecular electronics and drug delivery, slots for integration into nanodevices, and defects for tailoring the structure and properties. In this study, formability of polymethylmetacrylate(PMMA) and polycarbonate(PC) were characterized Polymer has extreme variation in thermo mechanical variation during forming high temperature. Because of heating the polymer, it becomes softer than at room temperature. In this case it is particularly important to study high temperature-induced mechanical properties of polymer. Nanoindenter XP(MTS) was used to measure thermo mechanical properties of PMMA and PC. Polymer was heated by using the heating stage on NanoXP. At CSM(Continuous Stiffness Method) mode test, heating temperature was $110^{\circ}C,120^{\circ}C,130^{\circ}C,140^{\circ}C$ and $150^{\circ}C$ for PMMA, $140^{\circ}C,150^{\circ}C,160^{\circ}C,170^{\circ}C$ and $180^{\circ}C$ for PC, respectively. Maximum indentation depth was 2000nm. At basic mode test, heating temperature was $90^{\circ}C$ and $110^{\circ}C$ for PMMA, $140^{\circ}C,160^{\circ}C$ for PC. Maximum load was 10mN, 20mN and 40mN. Also indented pattern was observed by using SEM and AFM. Mechanical properties of PMMA and PC decreased when temperature increased. Decrease of mechanical properties from PMMA went down rapidly than that of PC.

Keywords

References

  1. D. Hardt, B. Grnesan, W. Qi, M. Dirckx, A. Rzepnienwski, 2004, Process Control in Micro-Embossing-A Review, Singapore MIT Alliance Programme (SMA) in Innovation in Manufacturing Systems and Technology (IMST)
  2. C. G. Choi, 2004, Fabrication of optical waveguides in thermosetting polymers using hot embossing, J. Micromech. Microeng., Vol. 14, pp. 945-949 https://doi.org/10.1088/0960-1317/14/7/015
  3. W. S. Kim, K. B. Yoon, B. S. Bae, 2005, Nanopatterning of photonic crystals with a photocurable silica-titania organic-inorganic hybrid material by a UV-based nanoimprint technique, J. Mater. Chem., Vol. 15, pp. 4535-4539 https://doi.org/10.1039/b509622g
  4. K. Ishihara, M. Fujita, I. Matusubara, T. Asano, S. Noda, 2006, Direct Fabrication of Photonic Crystal on Glass Substrate by Nanoimprint Lithography, Japanese Journal of Applied Physics, Vol. 45, No. 7, pp. 210-212 https://doi.org/10.1143/JJAP.45.L210
  5. B. Heidari, I. Maximov, L. Montelius, 2000, Nanoimprint lithography at the 6 in. wafer scale, J. Vac. Sci. Technol. B Vol. 18, No. 6, pp. 3557-3560 https://doi.org/10.1116/1.1326923
  6. N. S. Cameron, H. Roberge, T. Veres, S. C. Jakeway, H. J. Crabtree, 2006, High fidelity, high yield production of microfluidic devices by hot embossing lithography: rheology and stiction, Lab Chip, Vol. 6, No. 7, pp. 936-941 https://doi.org/10.1039/b600584e
  7. X. Li, B. Bhushan, 2003, Fatigue studies of nanoscale structures for MEMS/NEMS applications using nanoindentation techniques, Surface and Coatings Technology, Vol. 163-164, pp. 521-526 https://doi.org/10.1016/S0257-8972(02)00662-X
  8. Graham L. W. Cross, Barry O'Connell, John B. Pethica, Warren Oliver, 2003, Mechanical Aspects of Nanoimprint Patterning, Nanotechnology, 2003. IEEE-NANO 2003. 2003 Third IEEE Conference on, Vol. 2, pp. 494-497
  9. L. J. Guo, 2004, Recent Progress in nanoimprint technology and its application, J. Pzhys. D. Vol. 37, pp. 123-141 https://doi.org/10.1088/0022-3727/37/11/R01
  10. H. C. Scheer, H. Schulz, 2001, A contribution to the flow behaviour of thin polymer films during hot embossing lithography, Microelectronic Eng., Vol. 56, pp. 311-332 https://doi.org/10.1016/S0167-9317(01)00569-X
  11. D. Yao, V. L. Virupaksha, Study on Squeezing Flow During Nonisothermal Embossing of Polymer Microstructures, Polymer eng. and Sci., Vol. 45, No. 5, pp. 652-660
  12. P. S. Malcolm, 1999, Third edition Polymerchemistry, Oxford University Press, pp. 100-106