Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 15 Issue 4
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- Pages.9-15
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- 2008
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Microstructure and Contact Resistance of the Au-Sn Flip-Chip Joints Processed by Electrodeposition
전기도금법을 이용하여 형성한 Au-Sn 플립칩 접속부의 미세구조 및 접속저항
Abstract
Microstructure and contact resistance of the Au-Sn solder joints were characterized after flip-chip bonding of the Au/Sn bumps processed by successive electrodeposition of Au and Sn. Microstructure of the Au-Sn solder joints, formed by flip-chip bonding at
Au와 Sn을 순차적으로 도금한 Au/Sn 범프를 플립칩 본딩하여 Au-Sn 솔더 접속부를 형성 후, 미세구조와 접속저항을 분석하였다.