대한기계학회논문집B (Transactions of the Korean Society of Mechanical Engineers B)

  • 제32권4호
  • /
  • Pages.255-265
  • /
  • 2008
  • /
  • 1226-4881(pISSN)
  • /
  • 2288-5324(eISSN)
대한기계학회 (The Korean Society of Mechanical Engineers)
권호 표지
DOI QR코드

DOI QR Code

고발열 CPU 냉각용 증기 압축식 냉각 시스템의 증발기 최적화

Optimization of Evaporator for a Vapor Compression Cooling System for High Heat Flux CPU

  • 김선창 (한국생산기술연구원 열유체시스템팀) ;
  • 전동순 (한국생산기술연구원 열유체시스템팀) ;
  • 김영률 (한국생산기술연구원 열유체시스템팀)
  • 발행 : 2008.04.01
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

This paper presents the optimization process of evaporator for a vapor compression cooling system for high heat flux CPU. The CPU thermal capacity was given by 300W. Evaporating temperature and mass flow rate were $18^{\circ}C$ and 0.00182kg/s respectively. R134a was used as a working fluid. Channel width(CW) and height(CH) were selected as design factors. And thermal resistance, surface temperature of CPU, degree of superheat, and pressure drop were taken as objective responses. Fractional factorial DOE was used in screening phase and RSM(Response Surface Method) was used in optimization phase. As a result, CW of 2.5mm, CH of 2.5mm, and CL of 484mm were taken as an optimum geometry. Surface temperature of CPU and thermal resistance were $33^{\circ}C\;and\;0.0502^{\circ}C/W$ respectively. Thermal resistance of evaporator designed in this study was significantly lower than that of other cooling systems such as water cooling system and thermosyphon system. It was found that the evaporator considered in this work can be a excellent candidate for a high heat flux CPU cooling system.

키워드

참고문헌

  1. Rhi, S. H., Shin, D. R. and Lim, T. K., 2006, 'Development of Nanofluidic Thermosyphon Heat Sink,' SAREK Journal, Vol. 10, pp. 826-834
  2. Lee, J. and Mudawar, I., 2005, 'Two Phase Flow in High Heat Flux Micro-channel Heat Sink for Refrigeration Cooling Applications Part II-Heat Transfer Characteristics,' International Journal of Heat and Mass Transfer, Vol. 48, pp. 941-955 https://doi.org/10.1016/j.ijheatmasstransfer.2004.09.019
  3. Kwon, O. K., Choi, M, J., Cha, D. A. and Yun, J. H., 2007, 'A Study on Thermal Performance of Microchannel Waterblock,' SAREK Journal, S-200, pp. 1242-1247
  4. Choi, M. J., Kwon, O. K., Cha, D. A. and Lee, C., 2007, 'A Numerical Analysis on Cooling Performance of Microchannel Waterblock for Electronic Device Cooling,' 2007 The Annual Spring Conference of The Korea Society of Mechanical Engineers, pp. 2426-2431
  5. Kim, M. S., Yoon, J. S. and Choi, J. W., 2006, 'A Study in the Micro Vapor Compressor Based on Micro Fabrication Process for the Application to the Micro Miniature Refrigeration System,' SAREK Journal, S-075, pp. 477-482
  6. Aqwu Nnanna, A. G., 2006, 'Application of Refrigeration System in Electronics Cooling,' Applied Thermal Engineering, vol. 26, pp. 18-27 https://doi.org/10.1016/j.applthermaleng.2005.04.012
  7. Schmidt, R. R. and Notohardjono, B. D., 2002, 'High-end Server Low-temperature Cooling,' IBM J. RES. & DE, NOVEMBER Vol. 46, No. 6
  8. Goth, G. F., Kearney, D. J., Meyer, U. D. and Porter, W., 2004, 'Hybrid Cooling with Cycle Steering in the IBM EServer Z990,' IBM J. RES. & DE, MAY/JULY Vol. 48, No. 3/4
  9. Pecht, M., 1990, Handbook of Electronics Package Design, Marcel Dekker inc., pp. 40-43
  10. Kim, Y. L., Kim, S. C., Park, S. S. and Jeon, D. S., 2007, 'Optimization of Vapor Compression Cooling Cycle for a High Heat Flux CPU,' KITECH Journal of Iindustrial Technology, Vol. 16, pp. 41-50
  11. Coollier, G. J., 1981, Convective Boiling and Condensation, Mcgraw-hill inc