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Fabrication and Evaluation of Tantalum Compacts for Sputtering Target Application

스퍼터링 타겟재의 응용을 목적으로 하는 탄탈륨 소결체의 제작 및 평가

  • Chang, Se-Hun (Korea Institute of Industrial Technology(KITECH), Gwangju Research Center) ;
  • Choi, Jung-Chul (Korea Institute of Industrial Technology(KITECH), Gwangju Research Center) ;
  • Choi, Se-Weon (Korea Institute of Industrial Technology(KITECH), Gwangju Research Center) ;
  • Oh, Ik-Hyun (Korea Institute of Industrial Technology(KITECH), Gwangju Research Center)
  • 장세훈 (한국생산기술연구원 광주연구센터) ;
  • 최정철 (한국생산기술연구원 광주연구센터) ;
  • 최세원 (한국생산기술연구원 광주연구센터) ;
  • 오익현 (한국생산기술연구원 광주연구센터)
  • Published : 2008.04.30

Abstract

In this study, tantalum (Ta) compacts were fabricated in a spark plasma sintering (SPS) process and their microstructure and mechanical properties were investigated. Ta compacts with a density of 99% were successfully fabricated by controlling the sintering conditions of the current and the temperature. The density and hardness were increased as the sintering temperature increased. The $Ta_2C$ compound was observed at the surface of the compacts due to the contact between the Ta powder and graphite mold during the sintering process. The main fracture mode showed a mixed type with intergranular and transgranular modes having some roughness.

Keywords

References

  1. J. S. Yoon and B. I. Kim, J. Power. Sour. 164, 959 (2007) https://doi.org/10.1016/j.jpowsour.2006.11.035
  2. M. Bischof, S. Mayer, H. Leitner, H. Clemens, P. Staron, E. Geiger, A. Voiticek, W. Knabl, Int. J. Refr. Met. Hard. Mater., 24, 437-444 (2006) https://doi.org/10.1016/j.ijrmhm.2005.08.001
  3. P. Angerer, E. Neubauer, L. G. Yu, K. A. Khor, nt. J. Refr. Met. Hard. Mater., 25, 280-285 (2007) https://doi.org/10.1016/j.ijrmhm.2006.10.001
  4. M. Yue, J. X. Zhang, W. Q. Liu, G. P. Wang, J. Magn. Magn. Meter., 271, 364-368 (2003) https://doi.org/10.1016/j.jmmm.2003.10.002
  5. J. X. Zhang, Q. M. Lu, K. G. Liu, L. Zhang, M. L. Zhou, Mater.Lett. 58, 1981-1984 (2004) https://doi.org/10.1016/j.matlet.2003.11.032
  6. J. R. Groza and A. Zavaliangos, Mater. Sci. Eng. A287, 171-177 (2000) https://doi.org/10.1016/S0921-5093(00)00771-1
  7. U. Anselmi-Tamburini, S. Gennari, J. E. Garay and Z. A. Munir, Mater. Sci. Eng., A394, 139-148 (2005) https://doi.org/10.1016/j.msea.2004.11.019
  8. N. Tamari, T. Tanaka, K. Tanaka, I. Kondoh, M. Kawahara and M. Tokita, J. Ceram. Soc. Jpn., 103, 740 (1995) https://doi.org/10.2109/jcersj.103.740
  9. D. Rittel, A. Bhattacharyya, B. Poon, J. Zhao and G. Ravichandran, Mater. Sci. Eng., A447, 65-70 (2007) https://doi.org/10.1016/j.msea.2006.10.064

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