Transactions of the Korean Society of Machine Tool Engineers (한국공작기계학회논문집)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
권호 표지

A Study on the Flatness Evaluation Method of the Dicing Chuck using Chucked-wafer

웨이퍼 장착을 이용한 다이싱 척의 평탄도 평가 방법에 관한 연구

  • 육인수 (한밭대학교 기계공학과 대학원) ;
  • 이호철 (한밭대학교 기계공학부)
  • Published : 2008.06.15
Download PDF
⟨ Previous Next ⟩

Abstract

This study was conducted to evaluate the flatness of the porous type of dicing chuck. Two measurement systems for a vacuum chuck with a porous type of ceramic plate were prepared using a digital indicator and a laser interferometer. 6 inch of silicon and glass wafer were also used. Vacuum pressure from 100mmHg to 700mmHg by 100mmHg was increased. From experiments, chucked-wafer flatness was converged to the dicing chuck flatness itself even though the repeatability of contact method using indicator was unstable. Finally, the chuck flatness was estimated below $2{\mu}m$ with peak-to valley value.

Keywords

References

  1. Une, A., Kunyoo, P., Mochida, M., Yoshitomi, K., and Matsui, S., 2003, "Characteristics of a vacuum pin chuck for ArF laser lithography," Microelectronic Engineering, Vol. 67/68, pp. 47-55 https://doi.org/10.1016/S0167-9317(03)00058-3
  2. Kalkowski, G., Risse, S., Harnisch, G., Pesche1, T., and Guyenot, V., 2001, "Precision chucks for future lithography," Fraunhofer IOF Annual Report, pp. 23-24
  3. Une, A., Yoshitomi, K., and Mochida, M., 2004, "Design of a new porous pin chuck with super high flatness," Microelectronic Engineering, Vol. 73/74, pp. 933-940 https://doi.org/10.1016/S0167-9317(04)00247-3
  4. Matsui, S., Ohira, F., Ishikawa, Y., Une, A., and Shimizu, A., 1997, "Development of Pin-type Vacuum Chuck for High Precision Machining-Study on Precision Chucking with Pins," Journal of Japan Society for Precision Engineering, Vol. 63, No. 12, pp. 1705-1709 https://doi.org/10.2493/jjspe.63.1705
  5. Yokoyama, K., and Yamada, K., 1998, "Flatness Change of Vacuum Chuck for Ultra-precision Machining Due to Thermal Deformation (1st Report) - Thermal Behavior of Vacuum Chuck," Journal of Japan Society for Precision Engineering, Vol. 64, No. 8, pp. 1201-1205 https://doi.org/10.2493/jjspe.64.1201
  6. Gao, H. Y., Tian, B. Z., Jia, Y., and Kang, R. K., 2005, "Investigation on the Dressing Shape of Vacuum Chuck in Wafer Rotation Grinding," Key Engineering Materials Advances in Abrasive Technology VIII, Vol. 291/292, pp. 171-176