A Study on Properties of Conductive Pattern by the Rheology Characteristics of Ag Pastes for Gravure Printing

그라비어 인쇄용 Ag Paste의 레오로지 특성에 따른 전도성 패턴의 물성 연구

  • Lee, Dong-Wook (Division of Image & Information, College of Engineering, Pukyong National University) ;
  • Cho, Mi-Jeong (Division of Image & Information, College of Engineering, Pukyong National University) ;
  • Lee, Mi-Young (Division of Image & Information, College of Engineering, Pukyong National University) ;
  • Nam, Su-Yong (Division of Image & Information, College of Engineering, Pukyong National University) ;
  • Lee, Taik-Min (Korea Institute of Machinery & Materials)
  • 이동욱 (부경대학교 공과대학 화상정보공학부) ;
  • 조미정 (부경대학교 공과대학 화상정보공학부) ;
  • 이미영 (부경대학교 공과대학 화상정보공학부) ;
  • 남수용 (부경대학교 공과대학 화상정보공학부) ;
  • 이택민 (한국기계연구원)
  • Published : 2008.03.01

Abstract

We have manufactured Ag pastes for gravure printing by adding different solvent contents. Then the gravure printability and properties of conductive patterns gravure-printed by the different rheology characteristics of pastes were investigated. The dispersity of pastes was increased and the viscosity and shear rate dependence of viscosity for pastes were decreased by increasing the solvent content. Also storage modulus G', loss modulus G" and angular frequency value when G" starts to be bigger than G' of pastes were increased by decreasing the solvent content. These mean a flow drop of paste. As a result of gravure printing using two plates which have different line counts(175line and 350line), conductive patterns printed using 175line were spreaded more but Ag packing, thickness and conductivity of the conductive patterns were better than those printed using 350line. And the spread values of conductive patterns were increased with solvent contents but the best properties for Ag packing, surface roughness and conductivity of the conductive pattern were obtained by paste (3) which has 550cps of viscosity at $100s^{-1}$ and tan ${\delta}$ > 1 at 10rad/s. As a result of gravure printing using 350 line plate and paste (3), the conductive pattern has $1.2{\mu}m$ of film thickness and $1.9{\times}10^{-5}{\Omega}{\cdot}cm$ of conductivity.

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